558-10-432M31-001101 Preci-Dip
Hersteller: Preci-DipDescription: PGA SOLDER TAIL 1.27MM
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 432 (31 x 31)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 224.51 EUR |
| 13+ | 206.01 EUR |
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Technische Details 558-10-432M31-001101 Preci-Dip
Description: PGA SOLDER TAIL 1.27MM, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: PGA, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 432 (31 x 31), Termination: Solder, Housing Material: FR4 Epoxy Glass, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.050" (1.27mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Brass.
Weitere Produktangebote 558-10-432M31-001101
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
| 558-10-432M31-001101 | Hersteller : Preci-dip |
IC & Component Sockets |
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