55909-0274-TR625 Molex
Hersteller: Molex
Description: 0.4 BTB PLG ASSY J-BENDTL 20CKTE
Packaging: Box
Features: Solder Retention
Connector Type: Plug, Outer Shroud Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 20
Pitch: 0.016" (0.40mm)
Height Above Board: 0.045" (1.14mm)
Contact Finish Thickness: 8.00µin (0.203µm)
Mated Stacking Heights: 1.5mm
Part Status: Active
Number of Rows: 2
Description: 0.4 BTB PLG ASSY J-BENDTL 20CKTE
Packaging: Box
Features: Solder Retention
Connector Type: Plug, Outer Shroud Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 20
Pitch: 0.016" (0.40mm)
Height Above Board: 0.045" (1.14mm)
Contact Finish Thickness: 8.00µin (0.203µm)
Mated Stacking Heights: 1.5mm
Part Status: Active
Number of Rows: 2
auf Bestellung 625 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
625+ | 1.97 EUR |
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Technische Details 55909-0274-TR625 Molex
Description: 0.4 BTB PLG ASSY J-BENDTL 20CKTE, Packaging: Box, Features: Solder Retention, Connector Type: Plug, Outer Shroud Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 20, Pitch: 0.016" (0.40mm), Height Above Board: 0.045" (1.14mm), Contact Finish Thickness: 8.00µin (0.203µm), Mated Stacking Heights: 1.5mm, Part Status: Active, Number of Rows: 2.