Suchergebnisse für "566476" : 13
Art der Ansicht :
Mindestbestellmenge: 25
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
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VLS252015ET-3R3M | TDK Corporation |
 Description: FIXED IND 3.3UH 1.05A 219MOHM SMPackaging: Cut Tape (CT) Tolerance: ±20% Package / Case: 1008 (2520 Metric) Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm) Mounting Type: Surface Mount Shielding: Shielded Type: Drum Core, Wirewound Operating Temperature: -40°C ~ 105°C DC Resistance (DCR): 219mOhm Max Current - Saturation (Isat): 1.2A Material - Core: Ferrite Inductance Frequency - Test: 1 MHz Supplier Device Package: 1008 (2520 Metric) Height - Seated (Max): 0.039" (1.00mm) Part Status: Not For New Designs Inductance: 3.3 µH Current Rating (Amps): 1.05 A |
auf Bestellung 1591 Stücke: Lieferzeit 10-14 Tag (e) |
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CY9BF124MBGL-GK9E1 | Infineon Technologies |
Description: IC MCU 32BIT 288KB FLASH 96FBGA Packaging: Tray Package / Case: 96-LFBGA Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 288KB (288K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M3 Data Converters: A/D 26x12b; D/A 2x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CSIO, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 96-FBGA (6x6) Part Status: Active Number of I/O: 60 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| CY9BF124MBGL-GK9E1 | Infineon Technologies |
MCU 32-bit ARM Cortex M3 RISC 288KB Flash 3.3V/5V 96-Pin FBGA Tray |
Produkt ist nicht verfügbar |
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CY9BF124MPMC-G-MNCGE2 | Infineon Technologies |
Description: IC MCU 32BIT 288KB FLASH 80LQFP Packaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 288KB (288K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M3 Data Converters: A/D 26x12b SAR; D/A 2x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CSIO, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 80-LQFP (12x12) Part Status: Active Number of I/O: 60 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| CY9BF124MPMC-G-MNCGE2 | Infineon Technologies |
MCU 32-bit ARM Cortex M3 RISC 288KB Flash 3.3V/5V 80-Pin LQFP Tray |
Produkt ist nicht verfügbar |
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| FFA.2S.305.CLAC62Z | LEMO |
Description: CONN CIRC PLUG 5P GOLD SLDR CUP Packaging: Bulk Features: Backshell Connector Type: Plug, Female Sockets and Male Pins Color: Silver Current Rating (Amps): 13A Mounting Type: Free Hanging (In-Line) Shielding: Shielded Number of Positions: 5 Orientation: Keyed Shell Size - Insert: 305 Operating Temperature: -55°C ~ 250°C Fastening Type: Push-Pull Termination: Solder Cup Ingress Protection: IP50 - Dust Protected Cable Opening: 0.205" ~ 0.244" (5.20mm ~ 6.20mm) Material Flammability Rating: UL94 V-0 Contact Finish - Mating: Gold Part Status: Active Shell Material: Brass Shell Finish: Chrome Primary Material: Metal |
Produkt ist nicht verfügbar |
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S29GL01GT11DHIV23 | Infineon Technologies |
Description: IC FLASH 1GBIT PARALLEL 64FBGA Packaging: Tape & Reel (TR) Package / Case: 64-LBGA Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.65V ~ 3.6V Technology: FLASH - NOR Memory Format: FLASH Supplier Device Package: 64-FBGA (9x9) Part Status: Active Write Cycle Time - Word, Page: 60ns Memory Interface: Parallel Access Time: 110 ns Memory Organization: 128M x 8 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S29GL01GT11DHIV23 | Infineon Technologies |
NOR Flash Parallel 3V/3.3V 1G-bit 128M x 8/64M x 16 110ns 64-Pin Fortified BGA T/R |
Produkt ist nicht verfügbar |
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S29GL01GT11DHV010 | Infineon Technologies |
Description: IC FLASH 1GBIT PARALLEL 64FBGA Packaging: Tray Package / Case: 64-LBGA Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NOR Memory Format: FLASH Supplier Device Package: 64-FBGA (9x9) Part Status: Active Write Cycle Time - Word, Page: 60ns Memory Interface: Parallel Access Time: 110 ns Memory Organization: 128M x 8 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S29GL01GT11DHV010 | Infineon Technologies |
NOR Flash Parallel 3V/3.3V 1G-bit 128M x 8/64M x 16 110ns 64-Pin Fortified BGA Tray |
Produkt ist nicht verfügbar |
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S29GL01GT11DHV020 | Infineon Technologies |
Description: IC FLASH 1GBIT PARALLEL 64FBGA Packaging: Tray Package / Case: 64-LBGA Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NOR Memory Format: FLASH Supplier Device Package: 64-FBGA (9x9) Part Status: Active Write Cycle Time - Word, Page: 60ns Memory Interface: Parallel Access Time: 110 ns Memory Organization: 128M x 8 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S29GL01GT11DHV020 | Infineon Technologies |
NOR Flash Parallel 3V/3.3V 1G-bit 128M x 8/64M x 16 110ns 64-Pin Fortified BGA Tray |
Produkt ist nicht verfügbar |
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VLS252015ET-3R3M | TDK Corporation |
Description: FIXED IND 3.3UH 1.05A 219MOHM SM Packaging: Tape & Reel (TR) Tolerance: ±20% Package / Case: 1008 (2520 Metric) Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm) Mounting Type: Surface Mount Shielding: Shielded Type: Drum Core, Wirewound Operating Temperature: -40°C ~ 105°C DC Resistance (DCR): 219mOhm Max Current - Saturation (Isat): 1.2A Material - Core: Ferrite Inductance Frequency - Test: 1 MHz Supplier Device Package: 1008 (2520 Metric) Height - Seated (Max): 0.039" (1.00mm) Part Status: Not For New Designs Inductance: 3.3 µH Current Rating (Amps): 1.05 A |
Produkt ist nicht verfügbar |
| VLS252015ET-3R3M |
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Hersteller: TDK Corporation
Description: FIXED IND 3.3UH 1.05A 219MOHM SM
Packaging: Cut Tape (CT)
Tolerance: ±20%
Package / Case: 1008 (2520 Metric)
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Shielding: Shielded
Type: Drum Core, Wirewound
Operating Temperature: -40°C ~ 105°C
DC Resistance (DCR): 219mOhm Max
Current - Saturation (Isat): 1.2A
Material - Core: Ferrite
Inductance Frequency - Test: 1 MHz
Supplier Device Package: 1008 (2520 Metric)
Height - Seated (Max): 0.039" (1.00mm)
Part Status: Not For New Designs
Inductance: 3.3 µH
Current Rating (Amps): 1.05 A
Description: FIXED IND 3.3UH 1.05A 219MOHM SM
Packaging: Cut Tape (CT)
Tolerance: ±20%
Package / Case: 1008 (2520 Metric)
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Shielding: Shielded
Type: Drum Core, Wirewound
Operating Temperature: -40°C ~ 105°C
DC Resistance (DCR): 219mOhm Max
Current - Saturation (Isat): 1.2A
Material - Core: Ferrite
Inductance Frequency - Test: 1 MHz
Supplier Device Package: 1008 (2520 Metric)
Height - Seated (Max): 0.039" (1.00mm)
Part Status: Not For New Designs
Inductance: 3.3 µH
Current Rating (Amps): 1.05 A
auf Bestellung 1591 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 25+ | 0.7 EUR |
| 29+ | 0.61 EUR |
| 32+ | 0.56 EUR |
| 50+ | 0.51 EUR |
| 100+ | 0.45 EUR |
| 250+ | 0.43 EUR |
| 500+ | 0.37 EUR |
| 1000+ | 0.33 EUR |
| CY9BF124MBGL-GK9E1 |
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Hersteller: Infineon Technologies
Description: IC MCU 32BIT 288KB FLASH 96FBGA
Packaging: Tray
Package / Case: 96-LFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 288KB (288K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 26x12b; D/A 2x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CSIO, I2C, LINbus, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 96-FBGA (6x6)
Part Status: Active
Number of I/O: 60
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 288KB FLASH 96FBGA
Packaging: Tray
Package / Case: 96-LFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 288KB (288K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 26x12b; D/A 2x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CSIO, I2C, LINbus, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 96-FBGA (6x6)
Part Status: Active
Number of I/O: 60
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| CY9BF124MBGL-GK9E1 |
|
Hersteller: Infineon Technologies
MCU 32-bit ARM Cortex M3 RISC 288KB Flash 3.3V/5V 96-Pin FBGA Tray
MCU 32-bit ARM Cortex M3 RISC 288KB Flash 3.3V/5V 96-Pin FBGA Tray
Produkt ist nicht verfügbar
| CY9BF124MPMC-G-MNCGE2 |
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Hersteller: Infineon Technologies
Description: IC MCU 32BIT 288KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 288KB (288K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 26x12b SAR; D/A 2x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CSIO, I2C, LINbus, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Active
Number of I/O: 60
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 288KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 288KB (288K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 26x12b SAR; D/A 2x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CSIO, I2C, LINbus, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Active
Number of I/O: 60
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| CY9BF124MPMC-G-MNCGE2 |
|
Hersteller: Infineon Technologies
MCU 32-bit ARM Cortex M3 RISC 288KB Flash 3.3V/5V 80-Pin LQFP Tray
MCU 32-bit ARM Cortex M3 RISC 288KB Flash 3.3V/5V 80-Pin LQFP Tray
Produkt ist nicht verfügbar
| FFA.2S.305.CLAC62Z |
|
Hersteller: LEMO
Description: CONN CIRC PLUG 5P GOLD SLDR CUP
Packaging: Bulk
Features: Backshell
Connector Type: Plug, Female Sockets and Male Pins
Color: Silver
Current Rating (Amps): 13A
Mounting Type: Free Hanging (In-Line)
Shielding: Shielded
Number of Positions: 5
Orientation: Keyed
Shell Size - Insert: 305
Operating Temperature: -55°C ~ 250°C
Fastening Type: Push-Pull
Termination: Solder Cup
Ingress Protection: IP50 - Dust Protected
Cable Opening: 0.205" ~ 0.244" (5.20mm ~ 6.20mm)
Material Flammability Rating: UL94 V-0
Contact Finish - Mating: Gold
Part Status: Active
Shell Material: Brass
Shell Finish: Chrome
Primary Material: Metal
Description: CONN CIRC PLUG 5P GOLD SLDR CUP
Packaging: Bulk
Features: Backshell
Connector Type: Plug, Female Sockets and Male Pins
Color: Silver
Current Rating (Amps): 13A
Mounting Type: Free Hanging (In-Line)
Shielding: Shielded
Number of Positions: 5
Orientation: Keyed
Shell Size - Insert: 305
Operating Temperature: -55°C ~ 250°C
Fastening Type: Push-Pull
Termination: Solder Cup
Ingress Protection: IP50 - Dust Protected
Cable Opening: 0.205" ~ 0.244" (5.20mm ~ 6.20mm)
Material Flammability Rating: UL94 V-0
Contact Finish - Mating: Gold
Part Status: Active
Shell Material: Brass
Shell Finish: Chrome
Primary Material: Metal
Produkt ist nicht verfügbar
| S29GL01GT11DHIV23 |
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Hersteller: Infineon Technologies
Description: IC FLASH 1GBIT PARALLEL 64FBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Part Status: Active
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 110 ns
Memory Organization: 128M x 8
DigiKey Programmable: Not Verified
Description: IC FLASH 1GBIT PARALLEL 64FBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Part Status: Active
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 110 ns
Memory Organization: 128M x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| S29GL01GT11DHIV23 |
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Hersteller: Infineon Technologies
NOR Flash Parallel 3V/3.3V 1G-bit 128M x 8/64M x 16 110ns 64-Pin Fortified BGA T/R
NOR Flash Parallel 3V/3.3V 1G-bit 128M x 8/64M x 16 110ns 64-Pin Fortified BGA T/R
Produkt ist nicht verfügbar
| S29GL01GT11DHV010 |
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Hersteller: Infineon Technologies
Description: IC FLASH 1GBIT PARALLEL 64FBGA
Packaging: Tray
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Part Status: Active
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 110 ns
Memory Organization: 128M x 8
DigiKey Programmable: Not Verified
Description: IC FLASH 1GBIT PARALLEL 64FBGA
Packaging: Tray
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Part Status: Active
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 110 ns
Memory Organization: 128M x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| S29GL01GT11DHV010 |
|
Hersteller: Infineon Technologies
NOR Flash Parallel 3V/3.3V 1G-bit 128M x 8/64M x 16 110ns 64-Pin Fortified BGA Tray
NOR Flash Parallel 3V/3.3V 1G-bit 128M x 8/64M x 16 110ns 64-Pin Fortified BGA Tray
Produkt ist nicht verfügbar
| S29GL01GT11DHV020 |
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Hersteller: Infineon Technologies
Description: IC FLASH 1GBIT PARALLEL 64FBGA
Packaging: Tray
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Part Status: Active
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 110 ns
Memory Organization: 128M x 8
DigiKey Programmable: Not Verified
Description: IC FLASH 1GBIT PARALLEL 64FBGA
Packaging: Tray
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Part Status: Active
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 110 ns
Memory Organization: 128M x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| S29GL01GT11DHV020 |
|
Hersteller: Infineon Technologies
NOR Flash Parallel 3V/3.3V 1G-bit 128M x 8/64M x 16 110ns 64-Pin Fortified BGA Tray
NOR Flash Parallel 3V/3.3V 1G-bit 128M x 8/64M x 16 110ns 64-Pin Fortified BGA Tray
Produkt ist nicht verfügbar
| VLS252015ET-3R3M |
|
Hersteller: TDK Corporation
Description: FIXED IND 3.3UH 1.05A 219MOHM SM
Packaging: Tape & Reel (TR)
Tolerance: ±20%
Package / Case: 1008 (2520 Metric)
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Shielding: Shielded
Type: Drum Core, Wirewound
Operating Temperature: -40°C ~ 105°C
DC Resistance (DCR): 219mOhm Max
Current - Saturation (Isat): 1.2A
Material - Core: Ferrite
Inductance Frequency - Test: 1 MHz
Supplier Device Package: 1008 (2520 Metric)
Height - Seated (Max): 0.039" (1.00mm)
Part Status: Not For New Designs
Inductance: 3.3 µH
Current Rating (Amps): 1.05 A
Description: FIXED IND 3.3UH 1.05A 219MOHM SM
Packaging: Tape & Reel (TR)
Tolerance: ±20%
Package / Case: 1008 (2520 Metric)
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Shielding: Shielded
Type: Drum Core, Wirewound
Operating Temperature: -40°C ~ 105°C
DC Resistance (DCR): 219mOhm Max
Current - Saturation (Isat): 1.2A
Material - Core: Ferrite
Inductance Frequency - Test: 1 MHz
Supplier Device Package: 1008 (2520 Metric)
Height - Seated (Max): 0.039" (1.00mm)
Part Status: Not For New Designs
Inductance: 3.3 µH
Current Rating (Amps): 1.05 A
Produkt ist nicht verfügbar