Hersteller: TE Connectivity / AMP
Other Tools GIB, TUBE

Hersteller: Eaton - Bussmann Electrical Division
Description: FUSE CERAMIC 15A 600VAC
Packaging: Bulk
Package / Case: Cartridge, Non-Standard
Size / Dimension: 0.810" Dia x 2.250" L (20.57mm x 57.15mm)
Fuse Type: Cartridge, Ceramic
Mounting Type: Requires Holder
Response Time: Fast Blow
Approval Agency: CE, CSA, UL
Breaking Capacity @ Rated Voltage: 200kA
Current Rating (Amps): 15 A
Voltage Rating - AC: 600 V
Current Rating (Amps): 15A
Applications: Electrical, Industrial
Class: J

Hersteller: Murrelektronik
I/O Modules Cube67 Valve-Interface, I/O Extension Module, DO16, Festo CPV , Sub-D 25 pol., 0,6m

Hersteller: Murrelektronik
I/O Modules Cube67 Valve-Interface, I/O Extension Module, DO16, SMC, Sub-D 25 pol., 0,6m

Hersteller: TE Application Tooling
Description: GIB, TUBE
Packaging: Bulk

Hersteller: Alpha Wire
Description: HEATSHRINK 1/8 6"
Features: Abrasion Resistant, Chemical Resistant
Packaging: Bulk
Color: Clear
Material: Polyolefin (PO), Irradiated
Length: 0.500' (152.40mm, 6.00")
Type: Tubing, Semi Rigid
Operating Temperature: -55°C ~ 135°C
Shrinkage Ratio: 2 to 1
Inner Diameter - Supplied: 0.125" (3.18mm)
Inner Diameter - Recovered: 0.062" (1.57mm)
Recovered Wall Thickness: 0.020" (0.51mm)
Shrink Temperature: 110°C
Shelf Life: 60 Months

Hersteller: Alpha Wire
Description: HEATSHRINK 3/16 6"
Features: Abrasion Resistant, Chemical Resistant
Packaging: Bulk
Color: Clear
Material: Polyolefin (PO), Irradiated
Length: 0.500' (152.40mm, 6.00")
Type: Tubing, Semi Rigid
Operating Temperature: -55°C ~ 135°C
Shrinkage Ratio: 2 to 1
Inner Diameter - Supplied: 0.187" (4.75mm)
Inner Diameter - Recovered: 0.093" (2.36mm)
Recovered Wall Thickness: 0.025" (0.64mm)
Shrink Temperature: 110°C
Shelf Life: 60 Months

Hersteller: Alpha Wire
Description: HEATSHRINK 3/16 4FT
Packaging: Bulk
Features: Abrasion Resistant, Chemical Resistant
Color: Clear
Material: Polyolefin (PO), Irradiated
Length: 4.00' (1.22m)
Type: Tubing, Semi Rigid
Operating Temperature: -55°C ~ 135°C
Shrinkage Ratio: 2 to 1
Inner Diameter - Supplied: 0.187" (4.75mm)
Inner Diameter - Recovered: 0.093" (2.36mm)
Recovered Wall Thickness: 0.025" (0.64mm)
Shrink Temperature: 110°C
Shelf Life: 60 Months

Hersteller: Infineon Technologies
Description: IC FLASH 128MBIT PARALLEL 64FBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 90 ns
Memory Organization: 8M x 16
DigiKey Programmable: Not Verified

Hersteller: Infineon Technologies
Description: IC FLASH 128MBIT PARALLEL 64FBGA
Packaging: Tray
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 90 ns
Memory Organization: 8M x 16
DigiKey Programmable: Not Verified

Hersteller: Infineon Technologies
Description: IC FLASH 128MBIT PARALLEL 64FBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 90 ns
Memory Organization: 8M x 16
DigiKey Programmable: Not Verified