Hersteller: Infineon

Hersteller: Infineon Technologies
Description: MOSFET N-CH 100V 130A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 130A (Tc)
Rds On (Max) @ Id, Vgs: 7mOhm @ 75A, 10V
Power Dissipation (Max): 300W (Tc)
Vgs(th) (Max) @ Id: 4V @ 250µA
Supplier Device Package: TO-220AB
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 250 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 7670 pF @ 50 V

Hersteller: TDK Corporation
Description: FIXED IND 10UH 640MA 336MOHM SMD
Packaging: Cut Tape (CT)
Tolerance: ±20%
Package / Case: Nonstandard
Size / Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Mounting Type: Surface Mount
Shielding: Shielded
Type: Drum Core, Wirewound
Operating Temperature: -40°C ~ 105°C
DC Resistance (DCR): 336mOhm Max
Current - Saturation (Isat): 640mA
Material - Core: Ferrite
Inductance Frequency - Test: 1 MHz
Height - Seated (Max): 0.047" (1.20mm)
Part Status: Not For New Designs
Inductance: 10 µH
Current Rating (Amps): 640 mA

Hersteller: TE Connectivity AMP Connectors
Description: CONN HSG 70POS HARNESS ASSY
Packaging: Bulk
Contact Termination: Crimp
Mounting Type: Free Hanging (In-Line)
Number of Positions: 70
Contact Type: Female Socket
Fastening Type: Lever Lock
Part Status: Last Time Buy

Hersteller: TE Connectivity AMP Connectors
Description: CONN HSG 70POS PLUG ASSY
Packaging: Bulk
Contact Termination: Crimp
Mounting Type: Free Hanging (In-Line)
Number of Positions: 70
Contact Type: Female Socket
Fastening Type: Lever Lock
Part Status: Active

Hersteller: Infineon Technologies
Description: IC MCU 32BT 8.1875MB FLSH 320BGA
Packaging: Tape & Reel (TR)
Package / Case: 320-LFBGA
Mounting Type: Surface Mount
Speed: 100MHz, 350MHz
Program Memory Size: 8.1875MB (8.1875M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F
Data Converters: A/D 114x12b SAR
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 320-BGA (17x17)
Part Status: Active
Number of I/O: 240
DigiKey Programmable: Not Verified

Hersteller: Infineon Technologies
Description: IC MCU 32BT 8.1875MB FLSH 320BGA
Packaging: Tray
Package / Case: 320-LFBGA
Mounting Type: Surface Mount
Speed: 100MHz, 350MHz
Program Memory Size: 8.1875MB (8.1875M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+/M4F
Data Converters: A/D 114x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 320-BGA (17x17)
Part Status: Active
Number of I/O: 240
DigiKey Programmable: Not Verified

Hersteller: TDK Corporation
Description: FIXED IND 10UH 640MA 336MOHM SMD
Packaging: Tape & Reel (TR)
Tolerance: ±20%
Package / Case: Nonstandard
Size / Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Mounting Type: Surface Mount
Shielding: Shielded
Type: Drum Core, Wirewound
Operating Temperature: -40°C ~ 105°C
DC Resistance (DCR): 336mOhm Max
Current - Saturation (Isat): 640mA
Material - Core: Ferrite
Inductance Frequency - Test: 1 MHz
Height - Seated (Max): 0.047" (1.20mm)
Part Status: Not For New Designs
Inductance: 10 µH
Current Rating (Amps): 640 mA