573400D00010G Boyd Laconia, LLC
Hersteller: Boyd Laconia, LLC
Description: HEATSINK D-PAK3 TIN PLATED SMD
Packaging: Tape & Reel (TR)
Material: Copper
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.220" (30.99mm)
Package Cooled: TO-268 (D³Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 14.00°C/W
Fin Height: 0.401" (10.20mm)
Material Finish: Tin
Part Status: Active
Description: HEATSINK D-PAK3 TIN PLATED SMD
Packaging: Tape & Reel (TR)
Material: Copper
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.220" (30.99mm)
Package Cooled: TO-268 (D³Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 14.00°C/W
Fin Height: 0.401" (10.20mm)
Material Finish: Tin
Part Status: Active
auf Bestellung 2000 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
250+ | 2.26 EUR |
500+ | 2.12 EUR |
1250+ | 1.98 EUR |
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Technische Details 573400D00010G Boyd Laconia, LLC
Description: HEATSINK D-PAK3 TIN PLATED SMD, Packaging: Tape & Reel (TR), Material: Copper, Length: 0.500" (12.70mm), Shape: Rectangular, Fins, Type: Top Mount, Width: 1.220" (30.99mm), Package Cooled: TO-268 (D³Pak), Attachment Method: SMD Pad, Power Dissipation @ Temperature Rise: 1.0W @ 20°C, Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM, Thermal Resistance @ Natural: 14.00°C/W, Fin Height: 0.401" (10.20mm), Material Finish: Tin, Part Status: Active.
Weitere Produktangebote 573400D00010G nach Preis ab 1.97 EUR bis 2.86 EUR
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
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573400D00010G | Hersteller : Boyd Laconia, LLC |
Description: HEATSINK D-PAK3 TIN PLATED SMD Packaging: Cut Tape (CT) Material: Copper Length: 0.500" (12.70mm) Shape: Rectangular, Fins Type: Top Mount Width: 1.220" (30.99mm) Package Cooled: TO-268 (D³Pak) Attachment Method: SMD Pad Power Dissipation @ Temperature Rise: 1.0W @ 20°C Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM Thermal Resistance @ Natural: 14.00°C/W Fin Height: 0.401" (10.20mm) Material Finish: Tin Part Status: Active |
auf Bestellung 2404 Stücke: Lieferzeit 21-28 Tag (e) |
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573400D00010G | Hersteller : Aavid | Heat Sinks Heat Sink for D3Pak, TO268 for D3PAK, TO268, Horizontal, 11 C/W, 30.99mm, T/R |
auf Bestellung 3222 Stücke: Lieferzeit 14-28 Tag (e) |
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573400D00010G | Hersteller : Aavid Thermalloy | Heat Sink Passive D3 PAK/TO-268 SMD Aluminum 11C/W Tin |
auf Bestellung 10000 Stücke: Lieferzeit 14-21 Tag (e) |
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573400D00010G | Hersteller : BOYD CORP |
Category: Heatsinks Description: Heatsink: die-cut Type of heatsink: die-cut Anzahl je Verpackung: 1 Stücke |
Produkt ist nicht verfügbar |
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573400D00010G | Hersteller : BOYD CORP |
Category: Heatsinks Description: Heatsink: die-cut Type of heatsink: die-cut |
Produkt ist nicht verfügbar |