573400D00010G Aavid
Hersteller: Aavid
Heat Sinks Heat Sink for D3Pak, TO268 for D3PAK, TO268, Horizontal, 11 C/W, 30.99mm, T/R
| Anzahl | Preis |
|---|---|
| 3+ | 1.38 EUR |
| 1500+ | 1.3 EUR |
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Technische Details 573400D00010G Aavid
Description: HEATSINK D-PAK3 TIN PLATED SMD, Part Status: Active, Material Finish: Tin, Fin Height: 0.401" (10.20mm), Thermal Resistance @ Natural: 14.00°C/W, Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM, Power Dissipation @ Temperature Rise: 1.0W @ 20°C, Attachment Method: SMD Pad, Package Cooled: TO-268 (D³Pak), Width: 1.220" (30.99mm), Type: Top Mount, Shape: Rectangular, Fins, Length: 0.500" (12.70mm), Material: Copper, Packaging: Tape & Reel (TR).
Weitere Produktangebote 573400D00010G nach Preis ab 4.23 EUR bis 6.48 EUR
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573400D00010G | Hersteller : Boyd Laconia, LLC |
Description: HEATSINK D-PAK3 TIN PLATED SMD Part Status: Active Material Finish: Tin Fin Height: 0.401" (10.20mm) Thermal Resistance @ Natural: 14.00°C/W Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM Power Dissipation @ Temperature Rise: 1.0W @ 20°C Attachment Method: SMD Pad Package Cooled: TO-268 (D³Pak) Width: 1.220" (30.99mm) Type: Top Mount Shape: Rectangular, Fins Length: 0.500" (12.70mm) Material: Copper Packaging: Tape & Reel (TR) |
auf Bestellung 2500 Stücke: Lieferzeit 10-14 Tag (e) |
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573400D00010G | Hersteller : Boyd Laconia, LLC |
Description: HEATSINK D-PAK3 TIN PLATED SMD Part Status: Active Material Finish: Tin Fin Height: 0.401" (10.20mm) Thermal Resistance @ Natural: 14.00°C/W Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM Power Dissipation @ Temperature Rise: 1.0W @ 20°C Attachment Method: SMD Pad Package Cooled: TO-268 (D³Pak) Width: 1.220" (30.99mm) Type: Top Mount Shape: Rectangular, Fins Length: 0.500" (12.70mm) Material: Copper Packaging: Cut Tape (CT) |
auf Bestellung 2500 Stücke: Lieferzeit 10-14 Tag (e) |
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