Produkte > AAVID > 573400D00010G

573400D00010G Aavid


Board-Level-Heatsinks_Cat.pdf
Hersteller: Aavid
Heat Sinks Heat Sink for D3Pak, TO268 for D3PAK, TO268, Horizontal, 11 C/W, 30.99mm, T/R
auf Bestellung 13746 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+1.64 EUR
1500+1.55 EUR
Mindestbestellmenge: 3 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
Produktrezensionen
Produktbewertung abgeben

Technische Details 573400D00010G Aavid

Description: HEATSINK D-PAK3 TIN PLATED SMD, Part Status: Active, Material Finish: Tin, Fin Height: 0.401" (10.20mm), Thermal Resistance @ Natural: 14.00°C/W, Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM, Power Dissipation @ Temperature Rise: 1.0W @ 20°C, Attachment Method: SMD Pad, Package Cooled: TO-268 (D³Pak), Width: 1.220" (30.99mm), Type: Top Mount, Shape: Rectangular, Fins, Length: 0.500" (12.70mm), Material: Copper, Packaging: Tape & Reel (TR).

Weitere Produktangebote 573400D00010G nach Preis ab 5.03 EUR bis 7.71 EUR

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit Privatkunde
573400D00010G 573400D00010G Boyd Laconia, LLC Board-Level-Heatsinks_Cat.pdf Description: HEATSINK D-PAK3 TIN PLATED SMD
Part Status: Active
Material Finish: Tin
Fin Height: 0.401" (10.20mm)
Thermal Resistance @ Natural: 14.00°C/W
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Attachment Method: SMD Pad
Package Cooled: TO-268 (D³Pak)
Width: 1.220" (30.99mm)
Type: Top Mount
Shape: Rectangular, Fins
Length: 0.500" (12.70mm)
Material: Copper
Packaging: Tape & Reel (TR)
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
250+5.7 EUR
500+5.49 EUR
750+5.37 EUR
1250+5.22 EUR
1750+5.13 EUR
2500+5.03 EUR
Mindestbestellmenge: 250 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
573400D00010G 573400D00010G Boyd Laconia, LLC Board-Level-Heatsinks_Cat.pdf Description: HEATSINK D-PAK3 TIN PLATED SMD
Part Status: Active
Material Finish: Tin
Fin Height: 0.401" (10.20mm)
Thermal Resistance @ Natural: 14.00°C/W
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Attachment Method: SMD Pad
Package Cooled: TO-268 (D³Pak)
Width: 1.220" (30.99mm)
Type: Top Mount
Shape: Rectangular, Fins
Length: 0.500" (12.70mm)
Material: Copper
Packaging: Cut Tape (CT)
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
3+7.71 EUR
10+6.84 EUR
25+6.52 EUR
50+6.3 EUR
100+6.07 EUR
Mindestbestellmenge: 3 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
573400D00010G Board-Level-Heatsinks_Cat.pdf
Hersteller: Boyd Laconia, LLC
Description: HEATSINK D-PAK3 TIN PLATED SMD
Part Status: Active
Material Finish: Tin
Fin Height: 0.401" (10.20mm)
Thermal Resistance @ Natural: 14.00°C/W
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Attachment Method: SMD Pad
Package Cooled: TO-268 (D³Pak)
Width: 1.220" (30.99mm)
Type: Top Mount
Shape: Rectangular, Fins
Length: 0.500" (12.70mm)
Material: Copper
Packaging: Tape & Reel (TR)
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
250+5.7 EUR
500+5.49 EUR
750+5.37 EUR
1250+5.22 EUR
1750+5.13 EUR
2500+5.03 EUR
Mindestbestellmenge: 250 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
573400D00010G Board-Level-Heatsinks_Cat.pdf
Hersteller: Boyd Laconia, LLC
Description: HEATSINK D-PAK3 TIN PLATED SMD
Part Status: Active
Material Finish: Tin
Fin Height: 0.401" (10.20mm)
Thermal Resistance @ Natural: 14.00°C/W
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Attachment Method: SMD Pad
Package Cooled: TO-268 (D³Pak)
Width: 1.220" (30.99mm)
Type: Top Mount
Shape: Rectangular, Fins
Length: 0.500" (12.70mm)
Material: Copper
Packaging: Cut Tape (CT)
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+7.71 EUR
10+6.84 EUR
25+6.52 EUR
50+6.3 EUR
100+6.07 EUR
Mindestbestellmenge: 3 Stücke
Im Einkaufswagen  Stück im Wert von  UAH