573400D00000G Boyd Laconia, LLC
Hersteller: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Part Status: Active
Material Finish: Tin
Fin Height: 0.401" (10.20mm)
Thermal Resistance @ Natural: 14.00°C/W
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Attachment Method: SMD Pad
Package Cooled: TO-268 (D³Pak)
Width: 1.220" (30.99mm)
Type: Top Mount
Shape: Rectangular, Fins
Length: 0.500" (12.70mm)
Packaging: Bulk
| Anzahl | Preis |
|---|---|
| 4+ | 4.79 EUR |
| 10+ | 4.67 EUR |
| 25+ | 4.55 EUR |
| 50+ | 4.29 EUR |
| 100+ | 4.04 EUR |
| 250+ | 3.79 EUR |
| 500+ | 3.66 EUR |
| 1000+ | 3.28 EUR |
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Technische Details 573400D00000G Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK, Part Status: Active, Material Finish: Tin, Fin Height: 0.401" (10.20mm), Thermal Resistance @ Natural: 14.00°C/W, Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM, Power Dissipation @ Temperature Rise: 1.0W @ 20°C, Attachment Method: SMD Pad, Package Cooled: TO-268 (D³Pak), Width: 1.220" (30.99mm), Type: Top Mount, Shape: Rectangular, Fins, Length: 0.500" (12.70mm), Packaging: Bulk.
Weitere Produktangebote 573400D00000G nach Preis ab 2.8 EUR bis 5.68 EUR
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573400D00000G | Hersteller : Aavid |
Heat Sinks Heat Sink for D3Pak, TO268 for D3PAK, TO268, Horizontal, 11 C/W, 30.99mm |
auf Bestellung 7888 Stücke: Lieferzeit 10-14 Tag (e) |
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