5AGZME5H2F35I3L Intel
Hersteller: Intel
Description: IC FPGA 150960 I/O 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Number of Gates: 534
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 603840
Supplier Device Package: 1152-FBGA (35x35)
Number of LABs/CLBs: 400000
Total RAM Bits: 34322432
Number of I/O: 150960
DigiKey Programmable: Not Verified
Description: IC FPGA 150960 I/O 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Number of Gates: 534
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 603840
Supplier Device Package: 1152-FBGA (35x35)
Number of LABs/CLBs: 400000
Total RAM Bits: 34322432
Number of I/O: 150960
DigiKey Programmable: Not Verified
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Technische Details 5AGZME5H2F35I3L Intel
Description: IC FPGA 150960 I/O 1152FBGA, Packaging: Tray, Package / Case: 1152-BBGA, FCBGA, Mounting Type: Surface Mount, Number of Gates: 534, Operating Temperature: -40°C ~ 100°C (TJ), Voltage - Supply: 0.82V ~ 0.88V, Number of Logic Elements/Cells: 603840, Supplier Device Package: 1152-FBGA (35x35), Number of LABs/CLBs: 400000, Total RAM Bits: 34322432, Number of I/O: 150960, DigiKey Programmable: Not Verified.