Hersteller: SCHURTER Inc.
Description: FUSE CERM 16A 250VAC 125VDC 5X20
Packaging: Tape & Reel (TR)
Package / Case: 5mm x 20mm
Size / Dimension: 0.205" Dia x 0.787" L (5.20mm x 20.00mm)
Fuse Type: Cartridge, Ceramic
Mounting Type: Requires Holder
Operating Temperature: -55°C ~ 125°C
Response Time: Slow Blow
Approval Agency: cURus
Breaking Capacity @ Rated Voltage: 500A AC, 1.5kA DC
Part Status: Active
Current Rating (Amps): 16 A
Voltage Rating - AC: 250 V
Voltage Rating - DC: 125 V
Melting I²t: 1272.0

Hersteller: SCHURTER Inc.
Description: FUSE CERM 16A 250VAC 125VDC 5X20
Packaging: Cut Tape (CT)
Package / Case: 5mm x 20mm
Size / Dimension: 0.205" Dia x 0.787" L (5.20mm x 20.00mm)
Fuse Type: Cartridge, Ceramic
Mounting Type: Requires Holder
Operating Temperature: -55°C ~ 125°C
Response Time: Slow Blow
Approval Agency: cURus
Breaking Capacity @ Rated Voltage: 500A AC, 1.5kA DC
Part Status: Active
Current Rating (Amps): 16 A
Voltage Rating - AC: 250 V
Voltage Rating - DC: 125 V
Melting I²t: 1272.0

Hersteller: Texas Instruments
Description: IC MPU SITARA 300MHZ 324NFBGA
Packaging: Tray
Package / Case: 324-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: -40°C ~ 90°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 324-NFBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR, DDR2, DDR3, DDR3L
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Random Number Generator
Part Status: Active
Additional Interfaces: CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART

Hersteller: Silicon Labs
Description: IC MCU 32BIT 1MB FLASH 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.98V ~ 3.8V
Connectivity: I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified

Hersteller: Texas Instruments
Description: IC BUFF NON-INVERT 5.5V 48-TVSOP
Packaging: Bulk
Package / Case: 48-TFSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 48-TVSOP

Hersteller: Silicon Labs
Description: IC MCU 32BIT 1MB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.98V ~ 3.8V
Connectivity: I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified

Hersteller: Samsung Electro-Mechanics
Description: RES SMD 12.4 OHM 1% 1/16W 0402
Power (Watts): 0.063W, 1/16W
Tolerance: ±1%
Features: Moisture Resistant
Packaging: Tape & Reel (TR)
Package / Case: 0402 (1005 Metric)
Temperature Coefficient: ±100ppm/°C
Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm)
Composition: Thick Film
Operating Temperature: -55°C ~ 155°C
Number of Terminations: 2
Supplier Device Package: 0402
Height - Seated (Max): 0.016" (0.40mm)
Resistance: 12.4 Ohms

Hersteller: Samsung Electro-Mechanics
Description: RES SMD 12.4 OHM 1% 1/16W 0402
Packaging: Cut Tape (CT)
Power (Watts): 0.063W, 1/16W
Tolerance: ±1%
Features: Moisture Resistant
Package / Case: 0402 (1005 Metric)
Temperature Coefficient: ±100ppm/°C
Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm)
Composition: Thick Film
Operating Temperature: -55°C ~ 155°C
Number of Terminations: 2
Supplier Device Package: 0402
Height - Seated (Max): 0.016" (0.40mm)
Resistance: 12.4 Ohms

Hersteller: Texas Instruments
Description: IC BUFF NON-INVERT 5.5V 48-TVSOP
Packaging: Cut Tape (CT)
Package / Case: 48-TFSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 48-TVSOP

Hersteller: Texas Instruments
Description: IC BUFF NON-INVERT 5.5V 48-TVSOP
Packaging: Tape & Reel (TR)
Package / Case: 48-TFSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 48-TVSOP