655-53AB

655-53AB

Hersteller: Wakefield Thermal
Material: 655-53AB Heatsinks
655.pdf
Informationen zu Lagerverfügbarkeit und Lieferzeiten
auf Bestellung 60 Stücke
Lieferzeit 7-14 Tag (e)

26+ 2.85 EUR
28+ 2.65 EUR
50+ 2.5 EUR
100+ 2.37 EUR

Technische Details 655-53AB

Description: HEATSINK CPU 40.6MM SQ H=.525", Type: Top Mount, Part Status: Active, Material Finish: Black Anodized, Material: Aluminum, Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 400 LFM, Power Dissipation @ Temperature Rise: 4.0W @ 40°C, Fin Height: 0.522" (13.27mm), Width: 1.600" (40.64mm), Length: 1.600" (40.64mm), Shape: Square, Pin Fins, Attachment Method: Thermal Tape, Adhesive (Not Included), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...).

Preis 655-53AB ab 2.37 EUR bis 5.88 EUR

655-53AB
655-53AB
Hersteller: Wakefield-Vette
Heat Sinks Omnidirectional Pin Fin Heat Sink for 40mm BGA and PowerPC, 40.6x13.3mm
intergrated-heatsink-wakefield-273031.pdf
auf Bestellung 1013 Stücke
Lieferzeit 14-28 Tag (e)
9+ 5.88 EUR
10+ 5.59 EUR
25+ 5.28 EUR
100+ 4.86 EUR
655-53AB
Hersteller: Wakefield Thermal
Material: 655-53AB Heatsinks
655.pdf
60 Stücke
655-53AB
655-53AB
Hersteller: Wakefield-Vette
Description: HEATSINK CPU 40.6MM SQ H=.525"
Type: Top Mount
Part Status: Active
Material Finish: Black Anodized
Material: Aluminum
Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 400 LFM
Power Dissipation @ Temperature Rise: 4.0W @ 40°C
Fin Height: 0.522" (13.27mm)
Width: 1.600" (40.64mm)
Length: 1.600" (40.64mm)
Shape: Square, Pin Fins
Attachment Method: Thermal Tape, Adhesive (Not Included)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
655.pdf
auf Bestellung 1315 Stücke
Lieferzeit 21-28 Tag (e)