655-53AB
Informationen zu Lagerverfügbarkeit und Lieferzeiten
auf Bestellung 60 Stücke
Lieferzeit 7-14 Tag (e)
auf Bestellung 60 Stücke
Lieferzeit 7-14 Tag (e)
Technische Details 655-53AB
Description: HEATSINK CPU 40.6MM SQ H=.525", Type: Top Mount, Part Status: Active, Material Finish: Black Anodized, Material: Aluminum, Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 400 LFM, Power Dissipation @ Temperature Rise: 4.0W @ 40°C, Fin Height: 0.522" (13.27mm), Width: 1.600" (40.64mm), Length: 1.600" (40.64mm), Shape: Square, Pin Fins, Attachment Method: Thermal Tape, Adhesive (Not Included), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...).
Preis 655-53AB ab 2.37 EUR bis 5.88 EUR
 Hersteller: Wakefield-Vette Heat Sinks Omnidirectional Pin Fin Heat Sink for 40mm BGA and PowerPC, 40.6x13.3mm 
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auf Bestellung 1013 Stücke  Lieferzeit 14-28 Tag (e) |
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655-53AB Hersteller: Wakefield Thermal Material: 655-53AB Heatsinks
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60 Stücke |
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 Hersteller: Wakefield-Vette Description: HEATSINK CPU 40.6MM SQ H=.525" Type: Top Mount Part Status: Active Material Finish: Black Anodized Material: Aluminum Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 400 LFM Power Dissipation @ Temperature Rise: 4.0W @ 40°C Fin Height: 0.522" (13.27mm) Width: 1.600" (40.64mm) Length: 1.600" (40.64mm) Shape: Square, Pin Fins Attachment Method: Thermal Tape, Adhesive (Not Included) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
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auf Bestellung 1315 Stücke Lieferzeit 21-28 Tag (e) |
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