655-53AB Wakefield Thermal Solutions
Hersteller: Wakefield Thermal Solutions
Description: HEATSINK CPU 40.6MM SQ H=.525"
Material Finish: Black Anodized
Fin Height: 0.522" (13.27mm)
Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 400 LFM
Power Dissipation @ Temperature Rise: 4.0W @ 40°C
Attachment Method: Thermal Tape, Adhesive (Not Included)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.600" (40.64mm)
Type: Top Mount
Shape: Square, Pin Fins
Length: 1.600" (40.64mm)
Material: Aluminum
Packaging: Bulk
| Anzahl | Preis |
|---|---|
| 5+ | 3.57 EUR |
| 10+ | 3.16 EUR |
| 25+ | 3.01 EUR |
| 50+ | 2.9 EUR |
| 100+ | 2.79 EUR |
| 250+ | 2.66 EUR |
| 500+ | 2.57 EUR |
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Technische Details 655-53AB Wakefield Thermal Solutions
Description: HEATSINK CPU 40.6MM SQ H=.525", Material Finish: Black Anodized, Fin Height: 0.522" (13.27mm), Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 400 LFM, Power Dissipation @ Temperature Rise: 4.0W @ 40°C, Attachment Method: Thermal Tape, Adhesive (Not Included), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Width: 1.600" (40.64mm), Type: Top Mount, Shape: Square, Pin Fins, Length: 1.600" (40.64mm), Material: Aluminum, Packaging: Bulk.
Weitere Produktangebote 655-53AB nach Preis ab 3.06 EUR bis 3.94 EUR
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655-53AB | Hersteller : Wakefield-Vette |
Heat Sinks The factory is currently not accepting orders for this product. |
auf Bestellung 944 Stücke: Lieferzeit 10-14 Tag (e) |
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655-53AB | Hersteller : Wakefield Thermal |
Heat Sinks Omnidirectional Pin Fin Heat Sink for 40mm BGA and PowerPC, 40.6x13.3mm |
Produkt ist nicht verfügbar |