658-25ABT3 Wakefield Thermal
Hersteller: Wakefield Thermal
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA; black; L: 27.9mm; W: 27.9mm; 658
Type of heatsink: extruded
Heatsink shape: grilled
Application: BGA
Colour: black
Length: 27.9mm
Width: 27.9mm
Height: 6.6mm
Material: aluminium
Material finishing: anodized
Plate thickness: 2mm
Manufacturer series: 658
Anzahl je Verpackung: 1 Stücke
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA; black; L: 27.9mm; W: 27.9mm; 658
Type of heatsink: extruded
Heatsink shape: grilled
Application: BGA
Colour: black
Length: 27.9mm
Width: 27.9mm
Height: 6.6mm
Material: aluminium
Material finishing: anodized
Plate thickness: 2mm
Manufacturer series: 658
Anzahl je Verpackung: 1 Stücke
auf Bestellung 1376 Stücke:
Lieferzeit 7-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
21+ | 3.43 EUR |
25+ | 2.89 EUR |
27+ | 2.73 EUR |
100+ | 2.72 EUR |
500+ | 2.62 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 658-25ABT3 Wakefield Thermal
Description: HEATSINK CPU 28MM SQ BLK W/TAPE, Packaging: Bulk, Material: Aluminum, Length: 1.100" (27.94mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.100" (27.94mm), Package Cooled: BGA, Attachment Method: Thermal Tape, Adhesive (Included), Power Dissipation @ Temperature Rise: 2.0W @ 40°C, Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 500 LFM, Fin Height: 0.250" (6.35mm), Material Finish: Black Anodized.
Weitere Produktangebote 658-25ABT3 nach Preis ab 2.62 EUR bis 6.37 EUR
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt | ||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
658-25ABT3 | Hersteller : Wakefield Thermal |
Category: Heatsinks Description: Heatsink: extruded; grilled; BGA; black; L: 27.9mm; W: 27.9mm; 658 Type of heatsink: extruded Heatsink shape: grilled Application: BGA Colour: black Length: 27.9mm Width: 27.9mm Height: 6.6mm Material: aluminium Material finishing: anodized Plate thickness: 2mm Manufacturer series: 658 |
auf Bestellung 1376 Stücke: Lieferzeit 14-21 Tag (e) |
|
|||||||||||||||||
658-25ABT3 | Hersteller : Wakefield-Vette |
Description: HEATSINK CPU 28MM SQ BLK W/TAPE Packaging: Bulk Material: Aluminum Length: 1.100" (27.94mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.100" (27.94mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 2.0W @ 40°C Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 500 LFM Fin Height: 0.250" (6.35mm) Material Finish: Black Anodized |
auf Bestellung 1913 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||||||||||||||||
658-25ABT3 | Hersteller : Wakefield-Vette | Heat Sinks Omnidirectional Pin Fin Heat Sink for 27mm BGA/PowerPC, 6.4mm H, Chomerics T412 |
auf Bestellung 1125 Stücke: Lieferzeit 14-28 Tag (e) |
|