658-25AB Wakefield Thermal
Hersteller: Wakefield Thermal
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA; black; L: 27.9mm; W: 27.9mm; 658
Type of heatsink: extruded
Heatsink shape: grilled
Application: BGA
Colour: black
Length: 27.9mm
Width: 27.9mm
Height: 6.4mm
Material: aluminium
Material finishing: anodized
Base thickness: 2mm
Manufacturer series: 658
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Technische Details 658-25AB Wakefield Thermal
Description: HEATSINK CPU 28MM SQ BLK, Packaging: Bulk, Material: Aluminum, Length: 1.100" (27.94mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.100" (27.94mm), Package Cooled: BGA, Attachment Method: Thermal Tape, Adhesive (Not Included), Power Dissipation @ Temperature Rise: 2.0W @ 40°C, Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 500 LFM, Fin Height: 0.250" (6.35mm), Material Finish: Black Anodized.
Weitere Produktangebote 658-25AB nach Preis ab 1.17 EUR bis 2.27 EUR
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658-25AB | Wakefield-Vette |
Description: HEATSINK CPU 28MM SQ BLK Packaging: Bulk Material: Aluminum Length: 1.100" (27.94mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.100" (27.94mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Not Included) Power Dissipation @ Temperature Rise: 2.0W @ 40°C Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 500 LFM Fin Height: 0.250" (6.35mm) Material Finish: Black Anodized |
auf Bestellung 10727 Stücke: Lieferzeit 10-14 Tag (e) |
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658-25AB | Wakefield Thermal |
Heat Sinks Omnidirectional Pin Fin Heat Sink for 27mm BGA and PowerPC, Aluminum |
auf Bestellung 2370 Stücke: Lieferzeit 10-14 Tag (e) |
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658-25AB | Wakefield-Vette |
Heat Sinks 28mm OMNIDIRECTIONAL |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
| 658-25AB |
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Hersteller: Wakefield-Vette
Description: HEATSINK CPU 28MM SQ BLK
Packaging: Bulk
Material: Aluminum
Length: 1.100" (27.94mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.100" (27.94mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 2.0W @ 40°C
Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 500 LFM
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
Description: HEATSINK CPU 28MM SQ BLK
Packaging: Bulk
Material: Aluminum
Length: 1.100" (27.94mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.100" (27.94mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 2.0W @ 40°C
Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 500 LFM
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
auf Bestellung 10727 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 10+ | 1.85 EUR |
| 11+ | 1.64 EUR |
| 25+ | 1.56 EUR |
| 50+ | 1.5 EUR |
| 100+ | 1.45 EUR |
| 250+ | 1.38 EUR |
| 500+ | 1.33 EUR |
| 1200+ | 1.27 EUR |
| 6000+ | 1.17 EUR |
| 658-25AB |
|
Hersteller: Wakefield Thermal
Heat Sinks Omnidirectional Pin Fin Heat Sink for 27mm BGA and PowerPC, Aluminum
Heat Sinks Omnidirectional Pin Fin Heat Sink for 27mm BGA and PowerPC, Aluminum
auf Bestellung 2370 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 2.27 EUR |
| 10+ | 1.99 EUR |
| 25+ | 1.72 EUR |
| 250+ | 1.64 EUR |
| 1200+ | 1.63 EUR |
| 658-25AB |
|
Hersteller: Wakefield-Vette
Heat Sinks 28mm OMNIDIRECTIONAL
Heat Sinks 28mm OMNIDIRECTIONAL
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)