658-25ABT1E Wakefield Thermal
Hersteller: Wakefield Thermal
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA; black; L: 27.9mm; W: 27.9mm; 658
Type of heatsink: extruded
Heatsink shape: grilled
Application: BGA
Colour: black
Length: 27.9mm
Width: 27.9mm
Height: 6.6mm
Material: aluminium
Material finishing: anodized
Base thickness: 2mm
Manufacturer series: 658
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Technische Details 658-25ABT1E Wakefield Thermal
Description: HEATSINK CPU 28MM SQ BLK W/TAPE, Packaging: Bulk, Material: Aluminum, Length: 1.100" (27.94mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.100" (27.94mm), Package Cooled: BGA, Attachment Method: Thermal Tape, Adhesive (Included), Power Dissipation @ Temperature Rise: 2.0W @ 40°C, Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 500 LFM, Fin Height: 0.250" (6.35mm), Material Finish: Black Anodized.
Weitere Produktangebote 658-25ABT1E nach Preis ab 3.07 EUR bis 7.08 EUR
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658-25ABT1E | Wakefield Thermal Solutions |
Description: HEATSINK CPU 28MM SQ BLK W/TAPE Packaging: Bulk Material: Aluminum Length: 1.100" (27.94mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.100" (27.94mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 2.0W @ 40°C Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 500 LFM Fin Height: 0.250" (6.35mm) Material Finish: Black Anodized |
auf Bestellung 1551 Stücke: Lieferzeit 10-14 Tag (e) |
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658-25ABT1E | Wakefield Thermal |
Heat Sinks Omnidirectional Pin Fin Heat Sink for 27mm BGA/PowerPC, Chomerics T405R |
auf Bestellung 460 Stücke: Lieferzeit 10-14 Tag (e) |
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658-25ABT1E | Wakefield-Vette |
Heat Sinks Omnidirectional Pin Fin Heat Sink for 27mm BGA/PowerPC, Chomerics T405R |
auf Bestellung 993 Stücke: Lieferzeit 10-14 Tag (e) |
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| 658-25ABT1E |
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Hersteller: Wakefield Thermal Solutions
Description: HEATSINK CPU 28MM SQ BLK W/TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.100" (27.94mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.100" (27.94mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.0W @ 40°C
Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 500 LFM
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
Description: HEATSINK CPU 28MM SQ BLK W/TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.100" (27.94mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.100" (27.94mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.0W @ 40°C
Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 500 LFM
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
auf Bestellung 1551 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 5+ | 4.5 EUR |
| 10+ | 3.99 EUR |
| 25+ | 3.8 EUR |
| 50+ | 3.67 EUR |
| 100+ | 3.53 EUR |
| 250+ | 3.37 EUR |
| 500+ | 3.24 EUR |
| 1400+ | 3.07 EUR |
| 658-25ABT1E |
|
Hersteller: Wakefield Thermal
Heat Sinks Omnidirectional Pin Fin Heat Sink for 27mm BGA/PowerPC, Chomerics T405R
Heat Sinks Omnidirectional Pin Fin Heat Sink for 27mm BGA/PowerPC, Chomerics T405R
auf Bestellung 460 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 5.3 EUR |
| 10+ | 4.74 EUR |
| 25+ | 4.5 EUR |
| 50+ | 4.33 EUR |
| 100+ | 4.27 EUR |
| 250+ | 4.06 EUR |
| 500+ | 3.86 EUR |
| 658-25ABT1E |
|
Hersteller: Wakefield-Vette
Heat Sinks Omnidirectional Pin Fin Heat Sink for 27mm BGA/PowerPC, Chomerics T405R
Heat Sinks Omnidirectional Pin Fin Heat Sink for 27mm BGA/PowerPC, Chomerics T405R
auf Bestellung 993 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 7.08 EUR |
| 10+ | 5.74 EUR |
| 25+ | 5.49 EUR |
| 100+ | 4.84 EUR |
| 250+ | 4.61 EUR |