658-35AB Wakefield Thermal
Hersteller: Wakefield ThermalCategory: Heatsinks
Description: Heatsink: extruded; grilled; BGA; black; L: 27.9mm; W: 27.9mm; 658
Base thickness: 2mm
Height: 8.9mm
Manufacturer series: 658
Length: 27.9mm
Width: 27.9mm
Material: aluminium
Colour: black
Material finishing: anodized
Application: BGA
Type of heatsink: extruded
Heatsink shape: grilled
Anzahl je Verpackung: 1 Stücke
auf Bestellung 672 Stücke:
Lieferzeit 7-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 75+ | 0.96 EUR |
| 81+ | 0.89 EUR |
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Produktbewertung abgeben
Technische Details 658-35AB Wakefield Thermal
Description: HEATSINK CPU 28MM SQBLK W/O TAPE, Packaging: Tray, Material: Aluminum, Length: 1.100" (27.94mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.100" (27.94mm), Package Cooled: BGA, Attachment Method: Thermal Tape, Adhesive (Not Included), Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 800 LFM, Fin Height: 0.350" (8.89mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote 658-35AB nach Preis ab 0.89 EUR bis 2.36 EUR
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658-35AB | Hersteller : Wakefield Thermal |
Category: Heatsinks Description: Heatsink: extruded; grilled; BGA; black; L: 27.9mm; W: 27.9mm; 658 Base thickness: 2mm Height: 8.9mm Manufacturer series: 658 Length: 27.9mm Width: 27.9mm Material: aluminium Colour: black Material finishing: anodized Application: BGA Type of heatsink: extruded Heatsink shape: grilled |
auf Bestellung 672 Stücke: Lieferzeit 14-21 Tag (e) |
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658-35AB | Hersteller : Wakefield-Vette |
Heat Sinks The factory is currently not accepting orders for this product. |
auf Bestellung 1139 Stücke: Lieferzeit 10-14 Tag (e) |
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658-35AB | Hersteller : Wakefield Thermal |
Heat Sinks Omnidirectional Pin Fin Heat Sink for 27mm BGA and PowerPC, Aluminum |
auf Bestellung 421 Stücke: Lieferzeit 10-14 Tag (e) |
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658-35AB | Hersteller : Wakefield-Vette |
Description: HEATSINK CPU 28MM SQBLK W/O TAPE Packaging: Tray Material: Aluminum Length: 1.100" (27.94mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.100" (27.94mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Not Included) Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 800 LFM Fin Height: 0.350" (8.89mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 13250 Stücke: Lieferzeit 10-14 Tag (e) |
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| 658-35AB | Hersteller : Wakefield Thermal Solutions, Inc. |
Heat Sink Passive BGA Pin Array Adhesive Black Anodized |
auf Bestellung 725 Stücke: Lieferzeit 14-21 Tag (e) |
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