658-35AB Wakefield-Vette
Hersteller: Wakefield-Vette
Heat Sinks The factory is currently not accepting orders for this product.
| Anzahl | Privatkunde |
|---|---|
| 2+ | 2.31 EUR |
| 10+ | 2.18 EUR |
| 100+ | 1.95 EUR |
| 250+ | 1.83 EUR |
| 500+ | 1.73 EUR |
| 1000+ | 1.61 EUR |
Artikel auf Bestellung
Nicht an unserem Lager — wir beziehen ihn nach Ihrer Bestellung vom Lieferantenlager.
Lieferzeit:
10-14 Tag (e)
Mindestmenge:
2 Stücke
Produktrezensionen
Produktbewertung abgeben
Technische Details 658-35AB Wakefield-Vette
Description: HEATSINK CPU 28MM SQBLK W/O TAPE, Packaging: Tray, Material: Aluminum, Length: 1.100" (27.94mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.100" (27.94mm), Package Cooled: BGA, Attachment Method: Thermal Tape, Adhesive (Not Included), Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 800 LFM, Fin Height: 0.350" (8.89mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote 658-35AB nach Preis ab 1.84 EUR bis 2.89 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||||||
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658-35AB | Wakefield Thermal |
Heat Sinks Omnidirectional Pin Fin Heat Sink for 27mm BGA and PowerPC, Aluminum |
auf Bestellung 1284 Stücke: Lieferzeit 10-14 Tag (e) |
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658-35AB | Wakefield Thermal Solutions |
Description: HEATSINK CPU 28MM SQBLK W/O TAPEPackaging: Tray Material: Aluminum Length: 1.100" (27.94mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.100" (27.94mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Not Included) Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 800 LFM Fin Height: 0.350" (8.89mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 13036 Stücke: Lieferzeit 10-14 Tag (e) |
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658-35AB | Wakefield Thermal |
Category: HeatsinksDescription: Heatsink: extruded; grilled; BGA; black; L: 27.9mm; W: 27.9mm; 658 Type of heatsink: extruded Heatsink shape: grilled Application: BGA Colour: black Length: 27.9mm Width: 27.9mm Height: 8.9mm Material: aluminium Material finishing: anodized Base thickness: 2mm Manufacturer series: 658 |
auf Bestellung 451 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| 658-35AB | Wakefield Thermal Solutions, Inc. |
Heat Sink Passive BGA Pin Array Adhesive Black Anodized |
auf Bestellung 725 Stücke: Lieferzeit 14-21 Tag (e) |
|
| 658-35AB |
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Hersteller: Wakefield Thermal
Heat Sinks Omnidirectional Pin Fin Heat Sink for 27mm BGA and PowerPC, Aluminum
Heat Sinks Omnidirectional Pin Fin Heat Sink for 27mm BGA and PowerPC, Aluminum
auf Bestellung 1284 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 2.81 EUR |
| 10+ | 1.98 EUR |
| 658-35AB |
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Hersteller: Wakefield Thermal Solutions
Description: HEATSINK CPU 28MM SQBLK W/O TAPE
Packaging: Tray
Material: Aluminum
Length: 1.100" (27.94mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.100" (27.94mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Not Included)
Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 800 LFM
Fin Height: 0.350" (8.89mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK CPU 28MM SQBLK W/O TAPE
Packaging: Tray
Material: Aluminum
Length: 1.100" (27.94mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.100" (27.94mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Not Included)
Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 800 LFM
Fin Height: 0.350" (8.89mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 13036 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 8+ | 2.89 EUR |
| 10+ | 2.56 EUR |
| 25+ | 2.44 EUR |
| 50+ | 2.36 EUR |
| 100+ | 2.26 EUR |
| 250+ | 2.15 EUR |
| 500+ | 2.08 EUR |
| 1000+ | 2.01 EUR |
| 5000+ | 1.84 EUR |
| 658-35AB |
![]() |
Hersteller: Wakefield Thermal
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA; black; L: 27.9mm; W: 27.9mm; 658
Type of heatsink: extruded
Heatsink shape: grilled
Application: BGA
Colour: black
Length: 27.9mm
Width: 27.9mm
Height: 8.9mm
Material: aluminium
Material finishing: anodized
Base thickness: 2mm
Manufacturer series: 658
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA; black; L: 27.9mm; W: 27.9mm; 658
Type of heatsink: extruded
Heatsink shape: grilled
Application: BGA
Colour: black
Length: 27.9mm
Width: 27.9mm
Height: 8.9mm
Material: aluminium
Material finishing: anodized
Base thickness: 2mm
Manufacturer series: 658
auf Bestellung 451 Stücke:
Lieferzeit 14-21 Tag (e)
| 658-35AB |
![]() |
Hersteller: Wakefield Thermal Solutions, Inc.
Heat Sink Passive BGA Pin Array Adhesive Black Anodized
Heat Sink Passive BGA Pin Array Adhesive Black Anodized
auf Bestellung 725 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 81+ | 2.21 EUR |
| 100+ | 2.12 EUR |



