66AK2L06XCMS2 Texas Instruments
Hersteller: Texas InstrumentsDescription: IC SOC MULTICORE DSP+ARM 900BGA
Packaging: Tray
Package / Case: 900-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: EBI/EMI, Ethernet, DMA, I2C, PCIe, SPI, UART/USART, USB 3.0, USIM
Type: DSP+ARM®
Operating Temperature: 0°C ~ 100°C (TC)
Non-Volatile Memory: ROM (384kB)
On-Chip RAM: 5.384MB
Voltage - I/O: 0.85V, 1.0V, 1.8V, 3.3V
Voltage - Core: Variable
Clock Rate: 1.2GHz
Supplier Device Package: 900-FCBGA (25x25)
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Technische Details 66AK2L06XCMS2 Texas Instruments
Description: IC SOC MULTICORE DSP+ARM 900BGA, Packaging: Tray, Package / Case: 900-BFBGA, FCBGA, Mounting Type: Surface Mount, Interface: EBI/EMI, Ethernet, DMA, I2C, PCIe, SPI, UART/USART, USB 3.0, USIM, Type: DSP+ARM®, Operating Temperature: 0°C ~ 100°C (TC), Non-Volatile Memory: ROM (384kB), On-Chip RAM: 5.384MB, Voltage - I/O: 0.85V, 1.0V, 1.8V, 3.3V, Voltage - Core: Variable, Clock Rate: 1.2GHz, Supplier Device Package: 900-FCBGA (25x25).
Weitere Produktangebote 66AK2L06XCMS2
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66AK2L06XCMS2 | Hersteller : Texas Instruments |
Digital Signal Processors & Controllers - DSP, DSC Multicore DSP+ARM KeyStone II System-on-Chip (SoC) 900-FCBGA 0 to 0 |
Produkt ist nicht verfügbar |