714-43-218-31-018000 Mill-Max Manufacturing Corp.
Hersteller: Mill-Max Manufacturing Corp.Description: CONN IC DIP SOCKET 18POS GOLD
Features: Carrier, Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
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Technische Details 714-43-218-31-018000 Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 18POS GOLD, Features: Carrier, Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: DIP, 0.1" (2.54mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 18 (2 x 9), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Brass Alloy, Part Status: Active.
Weitere Produktangebote 714-43-218-31-018000
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
| 714-43-218-31-018000 | Hersteller : Mill-Max |
IC & Component Sockets STANDARD RECEPTACLE CARRIER |
Produkt ist nicht verfügbar |