74ALVCH16825DGG112 NXP USA Inc.
Hersteller: NXP USA Inc.Description: IC BUFF NON-INVERT 3.6V 56-TSSOP
Packaging: Bulk
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 9
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 56-TSSOP
auf Bestellung 875 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 178+ | 2.57 EUR |
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Technische Details 74ALVCH16825DGG112 NXP USA Inc.
Description: IC BUFF NON-INVERT 3.6V 56-TSSOP, Packaging: Bulk, Package / Case: 56-TFSOP (0.240", 6.10mm Width), Output Type: 3-State, Mounting Type: Surface Mount, Number of Elements: 2, Logic Type: Buffer, Non-Inverting, Operating Temperature: -40°C ~ 85°C (TA), Voltage - Supply: 1.2V ~ 3.6V, Number of Bits per Element: 9, Current - Output High, Low: 24mA, 24mA, Supplier Device Package: 56-TSSOP.