77709-332LF Amphenol Communications Solutions


77709.pdf Hersteller: Amphenol Communications Solutions
BergStik, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single row, Double Body, Polarization, 1 Positions, 2.54mm (0.100in) Pitch
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Technische Details 77709-332LF Amphenol Communications Solutions

Description: CONN HDR STACK, Packaging: Bag, Color: Black, Mounting Type: Through Hole, Pitch: 0.100" (2.54mm), Termination: Solder, Contact Finish - Post (Mating): Gold, GXT™, Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm), Number of Rows: 1, Number of Positions: 1, Length - Overall Pin: 0.496" (12.600mm), Length - Post (Mating): 0.120" (3.050mm), Length - Stack Height: 0.256" (6.500mm), Length - Tail: 0.120" (3.050mm).

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77709-332LF Hersteller : Amphenol ICC (FCI) Description: CONN HDR STACK
Packaging: Bag
Color: Black
Mounting Type: Through Hole
Pitch: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold, GXT™
Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm)
Number of Rows: 1
Number of Positions: 1
Length - Overall Pin: 0.496" (12.600mm)
Length - Post (Mating): 0.120" (3.050mm)
Length - Stack Height: 0.256" (6.500mm)
Length - Tail: 0.120" (3.050mm)
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77709-332LF Hersteller : Amphenol FCI 77709-1363434.pdf Headers & Wire Housings BERGSTIK
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