7935-2-15-20-06-14-11-0 Mill-Max
Hersteller: Mill-Max
Circuit Board Hardware - PCB Low Profile Omniball with 3mm Solder Tail Length A .1181
| Anzahl | Preis |
|---|---|
| 1+ | 3.03 EUR |
| 10+ | 2.31 EUR |
| 100+ | 2.06 EUR |
| 500+ | 1.95 EUR |
| 1000+ | 1.85 EUR |
| 2000+ | 1.71 EUR |
| 10000+ | 1.69 EUR |
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Technische Details 7935-2-15-20-06-14-11-0 Mill-Max
Description: LOW PROFILE OMNIBALL WITH 3MM SO, Operating Force - Mid Compression: 80gf, Operating Force - Initial: 30gf, Plunger Size: 0.091" (2.31mm) Dia, Pad Layout Dimension: Circular - 0.122" (3.10mm) (TH), Minimum Working Height: 0.178" (4.52mm), Recommended Working Height: 0.193" (4.90mm), Maximum Working Height: 0.178" (4.52mm), Mating Cycles: 1000000, Contact Material: Brass Alloy, Contact Finish Thickness: 20.0µin (0.51µm), Contact Type: Sleeve & Plunger (Pogo Pins), Mounting Type: Through Hole, Current Rating (Amps): 6.4A, Contact Finish: Gold, Packaging: Bulk.
Weitere Produktangebote 7935-2-15-20-06-14-11-0
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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7935-2-15-20-06-14-11-0 | Hersteller : Mill-Max Manufacturing Corp. |
Description: LOW PROFILE OMNIBALL WITH 3MM SO Operating Force - Mid Compression: 80gf Operating Force - Initial: 30gf Plunger Size: 0.091" (2.31mm) Dia Pad Layout Dimension: Circular - 0.122" (3.10mm) (TH) Minimum Working Height: 0.178" (4.52mm) Recommended Working Height: 0.193" (4.90mm) Maximum Working Height: 0.178" (4.52mm) Mating Cycles: 1000000 Contact Material: Brass Alloy Contact Finish Thickness: 20.0µin (0.51µm) Contact Type: Sleeve & Plunger (Pogo Pins) Mounting Type: Through Hole Current Rating (Amps): 6.4A Contact Finish: Gold Packaging: Bulk |
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