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807-22-001-30-001101

807-22-001-30-001101 Mill-Max Manufacturing Corp.

2019-08%3A019.3.pdf Hersteller: Mill-Max Manufacturing Corp.
Description: CONTACT SPRING LOADED SMD GOLD
Packaging: Bulk
Features: Pick and Place
Contact Finish: Gold
Mounting Type: Surface Mount
Contact Type: Sleeve & Plunger (Pogo Pins)
Contact Finish Thickness: 20.0µin (0.51µm)
Contact Material: Copper Alloy
Mating Cycles: 1000000
Part Status: Active
Maximum Working Height: 0.137" (3.48mm)
Recommended Working Height: 0.117" (2.98mm)
Pad Layout Dimension: Circular - 0.072" (1.83mm)
Plunger Size: 0.042" (1.07mm) Dia
Operating Force - Initial: 25gf
Operating Force - Mid Compression: 60gf
auf Bestellung 1016 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
15+1.23 EUR
17+1.05 EUR
25+0.98 EUR
50+0.94 EUR
100+0.89 EUR
250+0.84 EUR
500+0.8 EUR
1000+0.76 EUR
Mindestbestellmenge: 15
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Technische Details 807-22-001-30-001101 Mill-Max Manufacturing Corp.

Description: CONTACT SPRING LOADED SMD GOLD, Packaging: Bulk, Features: Pick and Place, Contact Finish: Gold, Mounting Type: Surface Mount, Contact Type: Sleeve & Plunger (Pogo Pins), Contact Finish Thickness: 20.0µin (0.51µm), Contact Material: Copper Alloy, Mating Cycles: 1000000, Part Status: Active, Maximum Working Height: 0.137" (3.48mm), Recommended Working Height: 0.117" (2.98mm), Pad Layout Dimension: Circular - 0.072" (1.83mm), Plunger Size: 0.042" (1.07mm) Dia, Operating Force - Initial: 25gf, Operating Force - Mid Compression: 60gf.

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807-22-001-30-001101 807-22-001-30-001101 Hersteller : Mill-Max Mill-Max_807_DATASHEET_METRIC-1181468.pdf Circuit Board Hardware - PCB SMT INSL Spring Pins 3.48mm Height
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