807-22-001-30-003101 Mill-Max Manufacturing Corp.
Hersteller: Mill-Max Manufacturing Corp.Description: CONTACT SPRING LOADED SMD GOLD
Packaging: Bulk
Features: Pick and Place
Contact Finish: Gold
Mounting Type: Surface Mount
Contact Type: Sleeve & Plunger (Pogo Pins)
Contact Finish Thickness: 20.0µin (0.51µm)
Contact Material: Copper Alloy
Mating Cycles: 1000000
Part Status: Active
Maximum Working Height: 0.177" (4.50mm)
Recommended Working Height: 0.150" (3.80mm)
Pad Layout Dimension: Circular - 0.072" (1.83mm)
Plunger Size: 0.042" (1.07mm) Dia
Operating Force - Initial: 25gf
Operating Force - Mid Compression: 60gf
auf Bestellung 2705 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 13+ | 1.36 EUR |
| 16+ | 1.16 EUR |
| 25+ | 1.08 EUR |
| 50+ | 1.03 EUR |
| 100+ | 0.98 EUR |
| 250+ | 0.92 EUR |
| 500+ | 0.88 EUR |
| 1000+ | 0.84 EUR |
| 2500+ | 0.78 EUR |
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Technische Details 807-22-001-30-003101 Mill-Max Manufacturing Corp.
Description: CONTACT SPRING LOADED SMD GOLD, Packaging: Bulk, Features: Pick and Place, Contact Finish: Gold, Mounting Type: Surface Mount, Contact Type: Sleeve & Plunger (Pogo Pins), Contact Finish Thickness: 20.0µin (0.51µm), Contact Material: Copper Alloy, Mating Cycles: 1000000, Part Status: Active, Maximum Working Height: 0.177" (4.50mm), Recommended Working Height: 0.150" (3.80mm), Pad Layout Dimension: Circular - 0.072" (1.83mm), Plunger Size: 0.042" (1.07mm) Dia, Operating Force - Initial: 25gf, Operating Force - Mid Compression: 60gf.
Weitere Produktangebote 807-22-001-30-003101 nach Preis ab 0.74 EUR bis 1.37 EUR
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807-22-001-30-003101 | Hersteller : Mill-Max |
Circuit Board Hardware - PCB SMT INSL Spring Pins 4.50mm Height |
auf Bestellung 3976 Stücke: Lieferzeit 10-14 Tag (e) |
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