807-22-001-30-010101 Mill-Max Manufacturing Corp.
Hersteller: Mill-Max Manufacturing Corp.Description: CONTACT SPRING LOADED SMD GOLD
Packaging: Bulk
Features: Pick and Place
Contact Finish: Gold
Mounting Type: Surface Mount
Contact Type: Sleeve & Plunger (Pogo Pins)
Contact Finish Thickness: 20.0µin (0.51µm)
Contact Material: Copper Alloy
Mating Cycles: 1000000
Part Status: Active
Maximum Working Height: 0.255" (6.48mm)
Recommended Working Height: 0.228" (5.78mm)
Pad Layout Dimension: Circular - 0.082" (2.08mm)
Plunger Size: 0.042" (1.07mm) Dia
Operating Force - Initial: 25gf
Operating Force - Mid Compression: 60gf
auf Bestellung 1798 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 12+ | 1.58 EUR |
| 14+ | 1.34 EUR |
| 100+ | 1.2 EUR |
| 1000+ | 0.87 EUR |
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Technische Details 807-22-001-30-010101 Mill-Max Manufacturing Corp.
Description: CONTACT SPRING LOADED SMD GOLD, Packaging: Bulk, Features: Pick and Place, Contact Finish: Gold, Mounting Type: Surface Mount, Contact Type: Sleeve & Plunger (Pogo Pins), Contact Finish Thickness: 20.0µin (0.51µm), Contact Material: Copper Alloy, Mating Cycles: 1000000, Part Status: Active, Maximum Working Height: 0.255" (6.48mm), Recommended Working Height: 0.228" (5.78mm), Pad Layout Dimension: Circular - 0.082" (2.08mm), Plunger Size: 0.042" (1.07mm) Dia, Operating Force - Initial: 25gf, Operating Force - Mid Compression: 60gf.
Weitere Produktangebote 807-22-001-30-010101 nach Preis ab 1.08 EUR bis 2.35 EUR
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807-22-001-30-010101 | Hersteller : Mill-Max |
Circuit Board Hardware - PCB Spring Loaded Pin SMT, 0.255mm length |
auf Bestellung 1502 Stücke: Lieferzeit 14-28 Tag (e) |
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