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807-22-001-30-011101

807-22-001-30-011101 Mill-Max


MMMC_S_A0007399046_1-2559847.pdf Hersteller: Mill-Max
Circuit Board Hardware - PCB Spring Loaded Pin SMT, 0.275mm length
auf Bestellung 62 Stücke:

Lieferzeit 14-28 Tag (e)
Anzahl Preis ohne MwSt
24+2.22 EUR
30+ 1.76 EUR
100+ 1.53 EUR
500+ 1.38 EUR
920+ 1.22 EUR
2760+ 1.07 EUR
10120+ 1 EUR
Mindestbestellmenge: 24
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Technische Details 807-22-001-30-011101 Mill-Max

Description: CONTACT SPRING LOADED SMD GOLD, Packaging: Bulk, Features: Pick and Place, Contact Finish: Gold, Mounting Type: Surface Mount, Contact Type: Sleeve & Plunger (Pogo Pins), Contact Finish Thickness: 20.0µin (0.51µm), Contact Material: Copper Alloy, Mating Cycles: 1000000, Part Status: Active, Maximum Working Height: 0.275" (6.99mm), Recommended Working Height: 0.248" (6.29mm), Pad Layout Dimension: Circular - 0.082" (2.08mm), Plunger Size: 0.042" (1.07mm) Dia, Operating Force - Initial: 25gf, Operating Force - Mid Compression: 60gf.

Weitere Produktangebote 807-22-001-30-011101

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807-22-001-30-011101 807-22-001-30-011101 Hersteller : Mill-Max Manufacturing Corp. 2019-08%3A019.4.pdf Description: CONTACT SPRING LOADED SMD GOLD
Packaging: Bulk
Features: Pick and Place
Contact Finish: Gold
Mounting Type: Surface Mount
Contact Type: Sleeve & Plunger (Pogo Pins)
Contact Finish Thickness: 20.0µin (0.51µm)
Contact Material: Copper Alloy
Mating Cycles: 1000000
Part Status: Active
Maximum Working Height: 0.275" (6.99mm)
Recommended Working Height: 0.248" (6.29mm)
Pad Layout Dimension: Circular - 0.082" (2.08mm)
Plunger Size: 0.042" (1.07mm) Dia
Operating Force - Initial: 25gf
Operating Force - Mid Compression: 60gf
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