808-AG11D-LF TE Connectivity
auf Bestellung 5826 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis |
|---|---|
| 107+ | 1.36 EUR |
| 400+ | 1.3 EUR |
| 750+ | 1.21 EUR |
| 1500+ | 1.15 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 808-AG11D-LF TE Connectivity
Description: CONN IC DIP SOCKET 8POS GOLD, Features: Open Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 8 (2 x 4), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 25.0µin (0.63µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 25.0µin (0.63µm), Contact Material - Post: Copper, Part Status: Obsolete.
Weitere Produktangebote 808-AG11D-LF nach Preis ab 1.63 EUR bis 2 EUR
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808-AG11D-LF | Hersteller : TE Connectivity |
 Conn DIP Socket SKT 8 POS 2.54mm Solder ST Thru-Hole Box/Tube |
auf Bestellung 2096 Stücke: Lieferzeit 14-21 Tag (e) |
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808-AG11D-LF | Hersteller : TE Connectivity AMP Connectors |
Description: CONN IC DIP SOCKET 8POS GOLD Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 25.0µin (0.63µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 25.0µin (0.63µm) Contact Material - Post: Copper Part Status: Obsolete |
Produkt ist nicht verfügbar |
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808-AG11D-LF | Hersteller : TE Connectivity |
IC & Component Sockets DIP .3CL 08P S/M OFRM AU/SN |
Produkt ist nicht verfügbar |