Produkte > COMAIR ROTRON > 831502B00000
831502B00000

831502B00000 Comair Rotron

831502B00000.pdf
Hersteller: Comair Rotron
Description: HEATSINK STAMP 19X12.8X12.7MM
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 300 LFM
Power Dissipation @ Temperature Rise: 1.0W @ 30°C
Attachment Method: Clip
Package Cooled: TO-220, TO-262
Width: 0.504" (12.80mm)
Type: Board Level
Shape: Rectangular, Fins
Length: 0.750" (19.05mm)
Material: Aluminum
Packaging: Bulk
Material Finish: Black Anodized
Fin Height: 0.500" (12.70mm)
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Technische Details 831502B00000 Comair Rotron

Description: HEATSINK STAMP 19X12.8X12.7MM, Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 300 LFM, Power Dissipation @ Temperature Rise: 1.0W @ 30°C, Attachment Method: Clip, Package Cooled: TO-220, TO-262, Width: 0.504" (12.80mm), Type: Board Level, Shape: Rectangular, Fins, Length: 0.750" (19.05mm), Material: Aluminum, Packaging: Bulk, Material Finish: Black Anodized, Fin Height: 0.500" (12.70mm).