8420-21A1-RK-TP

8420-21A1-RK-TP 3M Electronic Solutions Division


ea8fbb9b2c8a12082b4e098b7eac8f93733b1349-2951642.pdf Hersteller: 3M Electronic Solutions Division
IC & Component Sockets 20P PLCC SOCKET SMT W/LOCATION POSTS
auf Bestellung 2543 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+2.83 EUR
10+ 2.29 EUR
100+ 2.15 EUR
250+ 1.92 EUR
500+ 1.75 EUR
1000+ 1.48 EUR
2500+ 1.44 EUR
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Produktbewertung abgeben

Technische Details 8420-21A1-RK-TP 3M Electronic Solutions Division

Description: CONN SOCKET PLCC 20POS TIN, Features: Closed Frame, Packaging: Tube, Mounting Type: Surface Mount, Type: PLCC, Operating Temperature: -40°C ~ 105°C, Number of Positions or Pins (Grid): 20 (4 x 5), Termination: Solder, Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 160.0µin (4.06µm), Contact Material - Mating: Copper Alloy, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 160.0µin (4.06µm), Contact Material - Post: Copper Alloy.

Weitere Produktangebote 8420-21A1-RK-TP

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis ohne MwSt
8420-21A1-RK-TP 8420-21A1-RK-TP Hersteller : 3M 3mtm-chip-carrier-sockets-4-row-sm-8400-series-ts2147.pdf Description: CONN SOCKET PLCC 20POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: PLCC
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 20 (4 x 5)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160.0µin (4.06µm)
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 160.0µin (4.06µm)
Contact Material - Post: Copper Alloy
Produkt ist nicht verfügbar