
8432-21A1-RK-TP 3M Electronic Solutions Division

IC & Component Sockets 32P PLCC SOCKET SMT W/LOCATION POSTS
auf Bestellung 1820 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
1+ | 3.17 EUR |
10+ | 2.24 EUR |
100+ | 2.15 EUR |
250+ | 1.97 EUR |
500+ | 1.85 EUR |
1914+ | 1.65 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 8432-21A1-RK-TP 3M Electronic Solutions Division
Description: CONN SOCKET PLCC 32POS TIN, Packaging: Tube, Features: Closed Frame, Mounting Type: Surface Mount, Type: PLCC, Operating Temperature: -40°C ~ 105°C, Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9), Termination: Solder, Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 160.0µin (4.06µm), Contact Material - Mating: Copper Alloy, Pitch - Post: 0.050" (1.27mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 160.0µin (4.06µm), Contact Material - Post: Copper Alloy, Part Status: Active.
Weitere Produktangebote 8432-21A1-RK-TP
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
---|---|---|---|---|---|
![]() |
8432-21A1-RK-TP | Hersteller : 3M |
![]() |
Produkt ist nicht verfügbar |
|
![]() |
8432-21A1-RK-TP | Hersteller : 3M |
![]() Packaging: Tube Features: Closed Frame Mounting Type: Surface Mount Type: PLCC Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 160.0µin (4.06µm) Contact Material - Mating: Copper Alloy Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 160.0µin (4.06µm) Contact Material - Post: Copper Alloy Part Status: Active |
Produkt ist nicht verfügbar |