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84535-201LF

84535-201LF FCI


84535.pdf Hersteller: FCI
Conn High Density RCP 200 POS 1.27mm Solder ST SMD T/R
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Technische Details 84535-201LF FCI

Description: CONN ARRAY RCPT 200POS SMD GOLD, Packaging: Tape & Reel (TR), Connector Type: Array, Female Sockets, Contact Finish: Gold or Gold, GXT™, Mounting Type: Surface Mount, Number of Positions: 200, Pitch: 0.050" (1.27mm), Height Above Board: 0.289" (7.35mm), Contact Finish Thickness: 50.0µin (1.27µm), Mated Stacking Heights: 8mm, 14mm, Number of Rows: 10.

Weitere Produktangebote 84535-201LF

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84535-201LF 84535-201LF Hersteller : Amphenol Communications Solutions-FCI 84535.pdf 200 Position BGA Receptacle, 8mm Component Height, 1.27mm x 1.27mm Array, Lead-free
Produkt ist nicht verfügbar
84535-201LF 84535-201LF Hersteller : Amphenol ICC (FCI) 84535.pdf Description: CONN ARRAY RCPT 200POS SMD GOLD
Packaging: Tape & Reel (TR)
Connector Type: Array, Female Sockets
Contact Finish: Gold or Gold, GXT™
Mounting Type: Surface Mount
Number of Positions: 200
Pitch: 0.050" (1.27mm)
Height Above Board: 0.289" (7.35mm)
Contact Finish Thickness: 50.0µin (1.27µm)
Mated Stacking Heights: 8mm, 14mm
Number of Rows: 10
Produkt ist nicht verfügbar
84535-201LF 84535-201LF Hersteller : Amphenol ICC (FCI) 84535.pdf Description: CONN ARRAY RCPT 200POS SMD GOLD
Packaging: Cut Tape (CT)
Connector Type: Array, Female Sockets
Contact Finish: Gold or Gold, GXT™
Mounting Type: Surface Mount
Number of Positions: 200
Pitch: 0.050" (1.27mm)
Height Above Board: 0.289" (7.35mm)
Contact Finish Thickness: 50.0µin (1.27µm)
Mated Stacking Heights: 8mm, 14mm
Number of Rows: 10
Produkt ist nicht verfügbar
84535-201LF 84535-201LF Hersteller : Amphenol FCI 84535.pdf Board to Board & Mezzanine Connectors 200P RECPT
Produkt ist nicht verfügbar