Produkte > 3M > 8468-21B1-RK-TR
8468-21B1-RK-TR

8468-21B1-RK-TR 3M


3mtm-chip-carrier-sockets-4-row-sm-8400-series-ts2147.pdf Hersteller: 3M
Description: CONN SOCKET PLCC 68POS TIN
Packaging: Tape & Reel (TR)
Features: Closed Frame
Mounting Type: Surface Mount
Type: PLCC
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 68 (4 x 17)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160.0µin (4.06µm)
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 160.0µin (4.06µm)
Contact Material - Post: Copper Alloy
Part Status: Active
auf Bestellung 1200 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
200+4.36 EUR
1000+ 3.95 EUR
Mindestbestellmenge: 200
Produktrezensionen
Produktbewertung abgeben

Technische Details 8468-21B1-RK-TR 3M

Description: CONN SOCKET PLCC 68POS TIN, Packaging: Tape & Reel (TR), Features: Closed Frame, Mounting Type: Surface Mount, Type: PLCC, Operating Temperature: -40°C ~ 105°C, Number of Positions or Pins (Grid): 68 (4 x 17), Termination: Solder, Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 160.0µin (4.06µm), Contact Material - Mating: Copper Alloy, Pitch - Post: 0.050" (1.27mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 160.0µin (4.06µm), Contact Material - Post: Copper Alloy, Part Status: Active.

Weitere Produktangebote 8468-21B1-RK-TR nach Preis ab 4.71 EUR bis 8.09 EUR

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis ohne MwSt
8468-21B1-RK-TR 8468-21B1-RK-TR Hersteller : 3M 3mtm-chip-carrier-sockets-4-row-sm-8400-series-ts2147.pdf Description: CONN SOCKET PLCC 68POS TIN
Packaging: Cut Tape (CT)
Features: Closed Frame
Mounting Type: Surface Mount
Type: PLCC
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 68 (4 x 17)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160.0µin (4.06µm)
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 160.0µin (4.06µm)
Contact Material - Post: Copper Alloy
Part Status: Active
auf Bestellung 1429 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4+5.44 EUR
Mindestbestellmenge: 4
8468-21B1-RK-TR 8468-21B1-RK-TR Hersteller : 3M Electronic Solutions Division 62074255ead63bd7ee299038194cccf20f500ef4-2950939.pdf IC & Component Sockets PLCC 68 POS SMT
auf Bestellung 4835 Stücke:
Lieferzeit 14-28 Tag (e)
Anzahl Preis ohne MwSt
7+8.09 EUR
10+ 7.36 EUR
100+ 6.47 EUR
250+ 5.67 EUR
500+ 5.49 EUR
1200+ 4.97 EUR
2400+ 4.71 EUR
Mindestbestellmenge: 7
8468-21B1-RK-TR 8468-21B1-RK-TR Hersteller : 3M Interconnect Solutions 1024085.pdf Conn PLCC Socket SKT 68 POS 1.27mm Solder ST SMD T/R
Produkt ist nicht verfügbar
8468-21B1-RK-TR 8468-21B1-RK-TR Hersteller : 3M Interconnect Solutions 1024085.pdf Conn PLCC Socket SKT 68 POS 1.27mm Solder ST SMD T/R
Produkt ist nicht verfügbar