89898-313LF Amphenol FCI
auf Bestellung 2441 Stücke:
Lieferzeit 14-28 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 6+ | 9.91 EUR |
| 10+ | 8.01 EUR |
| 102+ | 7.9 EUR |
| 255+ | 6.08 EUR |
| 510+ | 5.77 EUR |
| 10013+ | 5.15 EUR |
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Technische Details 89898-313LF Amphenol FCI
Description: CONN RCPT 26POS 0.1 GOLD SMD, Packaging: Box, Connector Type: Receptacle, Bottom or Top Entry, Mounting Type: Surface Mount, Number of Positions: 26, Style: Board to Board, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Mated Stacking Heights: 10.81mm, Insulation Color: Gray, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Post: Tin, Part Status: Active, Insulation Height: 0.275" (6.99mm), Row Spacing - Mating: 0.100" (2.54mm), Number of Rows: 2.
Weitere Produktangebote 89898-313LF nach Preis ab 7.32 EUR bis 10.76 EUR
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89898-313LF | Hersteller : Amphenol ICC (FCI) |
 Description: CONN RCPT 26POS 0.1 GOLD SMDPackaging: Box Connector Type: Receptacle, Bottom or Top Entry Mounting Type: Surface Mount Number of Positions: 26 Style: Board to Board Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Mated Stacking Heights: 10.81mm Insulation Color: Gray Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.275" (6.99mm) Row Spacing - Mating: 0.100" (2.54mm) Number of Rows: 2 |
auf Bestellung 781 Stücke: Lieferzeit 21-28 Tag (e) |
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