901-19-1-21-2-B-0 Wakefield-Vette
Hersteller: Wakefield-VetteDescription: HEAT SINK ELLIP FIN 19X19MM CLIP
Packaging: Box
Material: Aluminum
Length: 0.748" (19.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.748" (19.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 5.66°C/W @ 200 LFM
Thermal Resistance @ Natural: 10.70°C/W
Fin Height: 0.811" (20.60mm)
Material Finish: Black Anodized
Part Status: Active
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Technische Details 901-19-1-21-2-B-0 Wakefield-Vette
Description: HEAT SINK ELLIP FIN 19X19MM CLIP, Packaging: Box, Material: Aluminum, Length: 0.748" (19.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 0.748" (19.00mm), Package Cooled: BGA, Attachment Method: Push Pin, Thermal Resistance @ Forced Air Flow: 5.66°C/W @ 200 LFM, Thermal Resistance @ Natural: 10.70°C/W, Fin Height: 0.811" (20.60mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote 901-19-1-21-2-B-0
| Foto | Bezeichnung | Hersteller | Beschreibung |
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901-19-1-21-2-B-0 | Hersteller : Wakefield Thermal |
Heat Sinks Chipset Heat Sink with Clip, Elliptical, 19mm Chip Size, 20.6mm Height, Aluminum |
Produkt ist nicht verfügbar |
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| 901-19-1-21-2-B-0 | Hersteller : Wakefield Thermal |
Category: Heatsinks Description: Heatsink: extruded; grilled; BGA; black; L: 19mm; W: 19mm; H: 20.6mm Type of heatsink: extruded Heatsink shape: grilled Application: BGA Colour: black Length: 19mm Width: 19mm Height: 20.6mm Material: aluminium Material finishing: anodized Thermal resistance @200 LFM: 5.66°C/W Manufacturer series: 900 |
Produkt ist nicht verfügbar |