901-19-2-23-2-B-0 WAKEFIELD THERMAL
Hersteller: WAKEFIELD THERMAL
Description: WAKEFIELD THERMAL - 901-19-2-23-2-B-0 - HEAT SINK, CHIPSET, 10.55 DEG C/W
tariffCode: 76041090
productTraceability: No
rohsCompliant: YES
euEccn: NLR
isCanonical: Y
Wärmewiderstand: 10.55°C/W
hazardous: false
rohsPhthalatesCompliant: YES
directShipCharge: 25
usEccn: EAR99
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Technische Details 901-19-2-23-2-B-0 WAKEFIELD THERMAL
Description: HEATSINK 19X19X23MM PIN, Packaging: Box, Material: Aluminum, Length: 0.748" (19.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 0.748" (19.00mm), Package Cooled: BGA, Attachment Method: Push Pin, Thermal Resistance @ Forced Air Flow: 5.40°C/W @ 200 LFM, Thermal Resistance @ Natural: 10.60°C/W, Fin Height: 0.892" (22.65mm), Material Finish: Black Anodized.
Weitere Produktangebote 901-19-2-23-2-B-0
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901-19-2-23-2-B-0 | Hersteller : Wakefield Thermal Solutions |
Description: HEATSINK 19X19X23MM PIN Packaging: Box Material: Aluminum Length: 0.748" (19.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 0.748" (19.00mm) Package Cooled: BGA Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 5.40°C/W @ 200 LFM Thermal Resistance @ Natural: 10.60°C/W Fin Height: 0.892" (22.65mm) Material Finish: Black Anodized |
Produkt ist nicht verfügbar |
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901-19-2-23-2-B-0 | Hersteller : Wakefield Thermal |
Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 19mm Chip Size, 22.6mm Height, Aluminum |
Produkt ist nicht verfügbar |