Hersteller: KEMET
Description: CAP CER 0.015UF 25V C0G/NP0 0603
Tolerance: ±10%
Features: Low ESL, Soft Termination
Packaging: Tape & Reel (TR)
Voltage - Rated: 25V
Package / Case: 0603 (1608 Metric)
Temperature Coefficient: C0G, NP0
Size / Dimension: 0.063" L x 0.031" W (1.60mm x 0.80mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: Boardflex Sensitive, ESD Protection
Thickness (Max): 0.034" (0.87mm)
Part Status: Active
Capacitance: 0.015 µF

Hersteller: KEMET
Description: CAP CER 0.015UF 25V C0G/NP0 0603
Packaging: Cut Tape (CT)
Tolerance: ±10%
Features: Low ESL, Soft Termination
Voltage - Rated: 25V
Package / Case: 0603 (1608 Metric)
Temperature Coefficient: C0G, NP0
Size / Dimension: 0.063" L x 0.031" W (1.60mm x 0.80mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: Boardflex Sensitive, ESD Protection
Thickness (Max): 0.034" (0.87mm)
Part Status: Active
Capacitance: 0.015 µF

Hersteller: Vishay Beyschlag/Draloric/BC Components
Description: RES 1.1K OHM 1% 0.3W MELF 0102
Packaging: Tape & Reel (TR)
Power (Watts): 0.3W
Tolerance: ±1%
Features: Anti-Sulfur, Automotive AEC-Q200
Package / Case: MELF, 0102
Temperature Coefficient: ±50ppm/°C
Size / Dimension: 0.043" Dia x 0.087" L (1.10mm x 2.20mm)
Composition: Thin Film
Operating Temperature: -55°C ~ 155°C
Ratings: AEC-Q200
Number of Terminations: 2
Supplier Device Package: 0102
Resistance: 1.1 kOhms

Hersteller: Vishay Beyschlag/Draloric/BC Components
Description: RES 1.1K OHM 1% 0.3W MELF 0102
Power (Watts): 0.3W
Tolerance: ±1%
Features: Anti-Sulfur, Automotive AEC-Q200
Packaging: Cut Tape (CT)
Package / Case: MELF, 0102
Temperature Coefficient: ±50ppm/°C
Size / Dimension: 0.043" Dia x 0.087" L (1.10mm x 2.20mm)
Composition: Thin Film
Operating Temperature: -55°C ~ 155°C
Ratings: AEC-Q200
Number of Terminations: 2
Supplier Device Package: 0102
Resistance: 1.1 kOhms

Hersteller: Intel
CPU - Central Processing Units

Hersteller: Amphenol FCI
Power to the Board Minitek Power4.2 DR RATH HDR 14Pos Tin

Hersteller: Amphenol ICC (FCI)
Description: CONN PWR4.2 RA HEADER
Packaging: Tray
Features: Board Lock
Connector Type: Header
Voltage Rating: 600V
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Through Hole, Right Angle
Number of Positions: 14
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass
Insulation Color: Natural
Pitch - Mating: 0.165" (4.20mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Contact Length - Post: 0.138" (3.50mm)
Insulation Height: 0.386" (9.80mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.165" (4.20mm)

Hersteller: Amphenol FCI
Power to the Board Minitek Power4.2HCC DR VTH HDR 14Pos Tin

Hersteller: Amphenol FCI
Power to the Board Minitek Power4.2HCC DR VTH HDR 14Pos Tin

Hersteller: Amphenol FCI
Power to the Board Minitek Power4.2HCC DR VTH HDR 14Pos Tin

Hersteller: Amphenol FCI
Power to the Board Minitek Power4.2HCC DR VTH HDR 14Pos Tin

Hersteller: Amphenol FCI
Power to the Board Minitek Power4.2HCC DR VTH HDR 14Pos Tin

Hersteller: Amphenol FCI
Power to the Board Minitek Power4.2HCC DR VTH HDR 14Pos Tin

Hersteller: Amphenol FCI
Power to the Board Minitek Power4.2HCC DR VTH HDR 14Pos Tin

Hersteller: Amphenol FCI
Power to the Board Minitek Power4.2HCC DR VTH HDR 14Pos Tin

Hersteller: Sunbank / Souriau
Circular MIL Spec Backshells CONDUIT ASSEMBLY

Hersteller: Sunbank / Souriau
Circular MIL Spec Backshells CONDUIT ASSEMBLY

Hersteller: Sunbank / Souriau
Circular MIL Spec Backshells CONDUIT ASSEMBLY

Hersteller: BINDER
Category: Other Binder Connectors
Description: 79 1421 27 07

Hersteller: BINDER
Category: Other Binder Connectors
Description: 79 1421 27 07
Anzahl je Verpackung: 1 Stücke

Hersteller: Intel
Ethernet Server Adapter I350-F2, retail bulk

Hersteller: Intel
Ethernet Modules Ethernet Server Adapter I350-F2

Hersteller: NXP USA Inc.
Description: TRANS PREBIAS PNP 50V TO92-3
Packaging: Tape & Box (TB)
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 300mV @ 2.5mA, 50mA
Current - Collector Cutoff (Max): 500nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 50mA, 5V
Supplier Device Package: TO-92-3
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
Resistor - Base (R1): 2.2 kOhms
Resistor - Emitter Base (R2): 2.2 kOhms

Hersteller: Renesas Electronics Corporation
Description: OPTOISOLATOR 3.75KV TRANS 4SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, Gull Wing
Output Type: Transistor
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 100°C
Voltage - Forward (Vf) (Typ): 1.1V
Input Type: DC
Current - Output / Channel: 80mA
Voltage - Isolation: 3750Vrms
Current Transfer Ratio (Min): 50% @ 5mA
Vce Saturation (Max): 300mV
Current Transfer Ratio (Max): 300% @ 5mA
Supplier Device Package: 4-SOP
Voltage - Output (Max): 40V
Rise / Fall Time (Typ): 3µs, 5µs
Number of Channels: 1
Current - DC Forward (If) (Max): 50 mA