92FG Boyd Laconia, LLC
Hersteller: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Brass
Package Cooled: TO-92
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 1.0W @ 40°C
Thermal Resistance @ Forced Air Flow: 17.50°C/W @ 300 LFM
Thermal Resistance @ Natural: 36.10°C/W
Fin Height: 0.543" (13.80mm)
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Brass
Package Cooled: TO-92
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 1.0W @ 40°C
Thermal Resistance @ Forced Air Flow: 17.50°C/W @ 300 LFM
Thermal Resistance @ Natural: 36.10°C/W
Fin Height: 0.543" (13.80mm)
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Technische Details 92FG Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK, Packaging: Bulk, Material: Brass, Package Cooled: TO-92, Attachment Method: Clip and PC Pin, Power Dissipation @ Temperature Rise: 1.0W @ 40°C, Thermal Resistance @ Forced Air Flow: 17.50°C/W @ 300 LFM, Thermal Resistance @ Natural: 36.10°C/W, Fin Height: 0.543" (13.80mm).
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 Heat Sinks Clip-On Heat Sink, Low Cost, Brass, 1.73mm Dia. of PCB Plated Thru-Holes for Tab |
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