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| Foto | Bezeichnung | Hersteller | Beschreibung |
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FS32K148UJT0VLQR | NXP Semiconductors |
 ARM Microcontrollers - MCU S32K148 Arm Cortex-M4F, 112 MHz, 2 Mb Flash, FlexIO, CSEc security, ethernet, LQFP144 - S32K MCUs for General-Purpose |
auf Bestellung 500 Stücke: Lieferzeit 287-301 Tag (e) |
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FS32K148UJT0VLQT | NXP Semiconductors |
ARM Microcontrollers - MCU S32K148 Arm Cortex-M4F, 112 MHz, 2 Mb Flash, FlexIO, CSEc security, ethernet, LQFP144 - S32K MCUs for General-Purpose |
auf Bestellung 951 Stücke: Lieferzeit 14-28 Tag (e) |
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FS32K148UJT0VLQT | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 112MHz Program Memory Size: 2MB (2M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 32x12b SAR; D/A 1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: I2S, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 128 DigiKey Programmable: Not Verified |
auf Bestellung 583 Stücke: Lieferzeit 21-28 Tag (e) |
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FS32K148UJT0VLUT | NXP Semiconductors |
ARM Microcontrollers - MCU S32K148 Arm Cortex-M4F, 112 MHz, 2 Mb Flash, FlexIO, CSEc security, ethernet, LQFP176 - S32K MCUs for General-Purpose |
auf Bestellung 70 Stücke: Lieferzeit 14-28 Tag (e) |
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FS32K148UJT0VLUT | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 176LQFP Packaging: Tray Package / Case: 176-LQFP Mounting Type: Surface Mount Speed: 112MHz Program Memory Size: 2MB (2M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 32x12b SAR; D/A 1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: I2S, POR, PWM, WDT Supplier Device Package: 176-LQFP (24x24) Number of I/O: 156 DigiKey Programmable: Not Verified |
auf Bestellung 200 Stücke: Lieferzeit 21-28 Tag (e) |
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IMX-MIPI-HDMI | NXP Semiconductors |
Interface Development Tools MIPI to HDMI adaptor card (mini SAS) |
auf Bestellung 38 Stücke: Lieferzeit 14-28 Tag (e) |
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IMX-MIPI-HDMI | NXP Semiconductors |
High Reliability Evaluation Kit |
auf Bestellung 5 Stücke: Lieferzeit 14-21 Tag (e) |
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IMX-MIPI-HDMI | NXP USA Inc. |
Description: IMX-MIPI-HDMI Packaging: Bulk For Use With/Related Products: i.MX 8 Accessory Type: Interface Board Part Status: Active |
auf Bestellung 13 Stücke: Lieferzeit 21-28 Tag (e) |
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MC35FS4500NAE | NXP Semiconductors |
Power Management Specialised - PMIC System Basis chip, Linear 0.5A Vcore, LQFP48EP, Tray |
auf Bestellung 250 Stücke: Lieferzeit 55-69 Tag (e) |
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MC35FS4503CAE | NXP Semiconductors |
Power Management Specialised - PMIC Grade 0 safety CAN Buck/boost DC-DC |
auf Bestellung 573 Stücke: Lieferzeit 14-28 Tag (e) |
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MC35FS6500NAE | NXP Semiconductors |
Power Management Specialised - PMIC System Basis Chip, DCDC 0.8A Vcore, LQFP48EP, Tray |
auf Bestellung 250 Stücke: Lieferzeit 79-93 Tag (e) |
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MC35FS6513CAE | NXP Semiconductors |
Power Management Specialised - PMIC Grade 0 safety CAN Buck/boost DC-DC |
auf Bestellung 310 Stücke: Lieferzeit 14-28 Tag (e) |
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MC35FS6513CAE | NXP USA Inc. |
Description: SBC, DCDC 1.5A VCORE FS1B CAN,15 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 176 Stücke: Lieferzeit 21-28 Tag (e) |
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MCIMX6L3DVN10AC | NXP USA Inc. |
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA Packaging: Bulk Package / Case: 432-TFBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.2V, 1.8V, 3.0V Supplier Device Package: 432-MAPBGA (13x13) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART |
auf Bestellung 12786 Stücke: Lieferzeit 21-28 Tag (e) |
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MCIMX6S5DVM10AD | NXP Semiconductors |
Processors - Application Specialised i.MX 6S ROM Perf Enhan |
auf Bestellung 300 Stücke: Lieferzeit 14-28 Tag (e) |
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MCIMX6S5DVM10ADR | NXP Semiconductors |
SOC i.MX 6Solo ARM Cortex A9 40nm 624-Pin LFBGA T/R |
auf Bestellung 500 Stücke: Lieferzeit 14-21 Tag (e) |
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MCIMX6S5EVM10AD | NXP USA Inc. |
Description: IC MPU I.MX6S 1GHZ 624MAPBGA Packaging: Tray Package / Case: 624-LFBGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: -20°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-MAPBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART Part Status: Active |
auf Bestellung 300 Stücke: Lieferzeit 21-28 Tag (e) |
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MCIMX6S5EVM10AD | NXP Semiconductors |
Processors - Application Specialised i.MX 6S ROM Perf Enhan |
auf Bestellung 300 Stücke: Lieferzeit 140-154 Tag (e) |
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MCIMX6S5EVM10ADR | NXP Semiconductors |
Processors - Application Specialised i.MX 6S ROM Perf Enhan |
auf Bestellung 500 Stücke: Lieferzeit 14-28 Tag (e) |
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MCIMX6S6AVM10AD | NXP Semiconductors |
Processors - Application Specialised i.MX 6 series 32-bit MPU, ARM Cortex-A9 core, 1GHz, MAPBGA 624 |
auf Bestellung 300 Stücke: Lieferzeit 140-154 Tag (e) |
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MCIMX6U1AVM08AD | NXP Semiconductors |
Processors - Application Specialised i.MX6 DL ROM Perf Enhan |
auf Bestellung 300 Stücke: Lieferzeit 140-154 Tag (e) |
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MCIMX6U5DVM10AD | NXP Semiconductors |
Processors - Application Specialised i.MX 6DL ROM Perf Enhan |
auf Bestellung 49 Stücke: Lieferzeit 14-28 Tag (e) |
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MCIMX6U5EVM10AD | NXP Semiconductors |
Processors - Application Specialised i.MX 6DL ROM Perf Enhan |
auf Bestellung 300 Stücke: Lieferzeit 140-154 Tag (e) |
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MCIMX6U6AVM08AD | NXP Semiconductors |
Processors - Application Specialised i.MX6 ROM Perf Enhan |
auf Bestellung 300 Stücke: Lieferzeit 14-28 Tag (e) |
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MCIMX6U6AVM10AD | NXP Semiconductors |
Processors - Application Specialised i.MX 6 series 32-bit MPU, Dual ARM Cortex-A9 core, 1 GHz, MAPBGA 624 |
auf Bestellung 300 Stücke: Lieferzeit 14-28 Tag (e) |
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MCIMX6U6AVM10AD | NXP Semiconductors |
SOC i.MX 6DualLite ARM Cortex A9 40nm Automotive 624-Pin LFBGA Tray |
auf Bestellung 120 Stücke: Lieferzeit 14-21 Tag (e) |
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MCIMX6U8DVM10AD | NXP Semiconductors |
Processors - Application Specialised i.MX 6DL ROM Perf Enhan |
auf Bestellung 270 Stücke: Lieferzeit 14-28 Tag (e) |
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MK27FN2M0AVMI15 | NXP Semiconductors |
ARM Microcontrollers - MCU 150MHz ARM Cortex 2.1 |
auf Bestellung 350 Stücke: Lieferzeit 126-140 Tag (e) |
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MK28FN2M0AVMI15 | NXP Semiconductors |
ARM Microcontrollers - MCU 150MHz ARM Cortex 2.1 |
auf Bestellung 50 Stücke: Lieferzeit 14-28 Tag (e) |
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MMRF5017HSR5 | NXP USA Inc. |
Description: RF MOSFET HEMT 50V NI400 Packaging: Bulk Package / Case: NI-400S-2S Mounting Type: Surface Mount Frequency: 30MHz ~ 2.2GHz Power - Output: 125W Gain: 18.4dB Technology: HEMT Supplier Device Package: NI-400S-2S Voltage - Rated: 150 V Voltage - Test: 50 V Current - Test: 200 mA |
auf Bestellung 125 Stücke: Lieferzeit 21-28 Tag (e) |
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MMRF5017HSR5 | NXP USA Inc. |
Description: RF MOSFET HEMT 50V NI400 Packaging: Tray Package / Case: NI-400S-2S Mounting Type: Surface Mount Frequency: 30MHz ~ 2.2GHz Power - Output: 125W Gain: 18.4dB Technology: HEMT Supplier Device Package: NI-400S-2S Part Status: Active Voltage - Rated: 150 V Voltage - Test: 50 V Current - Test: 200 mA |
auf Bestellung 1 Stücke: Lieferzeit 21-28 Tag (e) |
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MRF13750HR5 | NXP Semiconductors |
RF MOSFET Transistors RF Power LDMOS Transistor 750 W |
auf Bestellung 27 Stücke: Lieferzeit 14-28 Tag (e) |
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OM40000UL | NXP Semiconductors |
Development Boards & Kits - ARM LPC802 Dev Tool LPCXresso802 |
auf Bestellung 14 Stücke: Lieferzeit 14-28 Tag (e) |
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OM40000UL | NXP USA Inc. |
Description: LPCXPRESSO LPC802 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M0+ Board Type: Evaluation Platform Utilized IC / Part: LPC802 Platform: LPCXpresso™ Part Status: Active |
auf Bestellung 208 Stücke: Lieferzeit 21-28 Tag (e) |
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OM40001UL | NXP Semiconductors |
Development Boards & Kits - ARM LPC804 Dev Tool LPCXresso804 |
auf Bestellung 33 Stücke: Lieferzeit 765-779 Tag (e) |
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OM40002UL | NXP Semiconductors |
Development Boards & Kits - ARM LPC8N04 NFC Kit |
auf Bestellung 9 Stücke: Lieferzeit 14-28 Tag (e) |
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OM40002UL | NXP USA Inc. |
Description: LPC8N04 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M0+ Board Type: Evaluation Platform Utilized IC / Part: LPC8N04 Part Status: Active |
auf Bestellung 14 Stücke: Lieferzeit 21-28 Tag (e) |
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| OM40004UL | NXP USA Inc. |
Description: LPC845 CAPACITIVE TOUCH DEV. KIT Packaging: Bulk Sensor Type: Touch, Capacitive Utilized IC / Part: LPC845 Supplied Contents: Board(s) Part Status: Active |
auf Bestellung 25 Stücke: Lieferzeit 21-28 Tag (e) |
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OM40005UL | NXP Semiconductors |
Development Boards & Kits - ARM OM40005 |
auf Bestellung 10 Stücke: Lieferzeit 14-28 Tag (e) |
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OM40005UL | NXP USA Inc. |
Description: LPCXPRESSO LPC51U68 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M0+ Board Type: Evaluation Platform Utilized IC / Part: LPC51U68 Platform: LPCXpresso™ Part Status: Active |
auf Bestellung 23 Stücke: Lieferzeit 21-28 Tag (e) |
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TFA9891UK/N1/S1Z | NXP USA Inc. |
Description: IC AMP CLASS D MONO 3.6W 49WLCSP Packaging: Bulk Features: Depop, Short-Circuit and Thermal Protection Package / Case: 49-UFBGA, WLCSP Output Type: 1-Channel (Mono) Mounting Type: Surface Mount Type: Class D Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 5.5V Max Output Power x Channels @ Load: 3.6W x 1 @ 8Ohm Supplier Device Package: 49-WLCSP (3.43x2.98) Part Status: Obsolete |
auf Bestellung 1970 Stücke: Lieferzeit 21-28 Tag (e) |
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UPS1C332MHD1TN | Nichicon |
Description: CAP ALUM 3300UF 20% 16V RADIAL Packaging: Tape & Box (TB) Tolerance: ±20% Package / Case: Radial, Can Size / Dimension: 0.630" Dia (16.00mm) Polarization: Polar Mounting Type: Through Hole Operating Temperature: -55°C ~ 105°C Applications: General Purpose Lead Spacing: 0.295" (7.50mm) Lifetime @ Temp.: 3000 Hrs @ 105°C Height - Seated (Max): 1.063" (27.00mm) Part Status: Not For New Designs Capacitance: 3300 µF Voltage - Rated: 16 V Impedance: 38 mOhms Ripple Current @ Low Frequency: 1.653 A @ 120 Hz Ripple Current @ High Frequency: 1.9 A @ 100 kHz |
auf Bestellung 250 Stücke: Lieferzeit 21-28 Tag (e) |
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UPS1C332MHD1TN | Nichicon |
Description: CAP ALUM 3300UF 20% 16V RADIAL Tolerance: ±20% Packaging: Cut Tape (CT) Package / Case: Radial, Can Size / Dimension: 0.630" Dia (16.00mm) Polarization: Polar Mounting Type: Through Hole Operating Temperature: -55°C ~ 105°C Applications: General Purpose Lead Spacing: 0.295" (7.50mm) Lifetime @ Temp.: 3000 Hrs @ 105°C Height - Seated (Max): 1.063" (27.00mm) Part Status: Not For New Designs Capacitance: 3300 µF Voltage - Rated: 16 V Impedance: 38 mOhms Ripple Current @ Low Frequency: 1.653 A @ 120 Hz Ripple Current @ High Frequency: 1.9 A @ 100 kHz |
auf Bestellung 238 Stücke: Lieferzeit 21-28 Tag (e) |
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| 935360 | Intel | CPU - Central Processing Units |
Produkt ist nicht verfügbar |
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| 2-1393536-0 | TE Connectivity AMP Connectors |
Description: CONN DIP HDR IDC 40POS PCB Packaging: Bulk Features: Feed Through, Strain Relief Connector Type: Ribbon Cable, DIP Header Contact Finish: Tin Mounting Type: Through Hole, Press-Fit Number of Positions: 40 Row Spacing: 0.100" (2.54mm) Contact Finish Thickness: 196.9µin (5.00µm) Cable Termination: IDC Cable Pitch: 0.050" (1.27mm) Board-Side Pitch: 0.100" (2.54mm) Number of Rows: 2 |
Produkt ist nicht verfügbar |
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| 35360811 | Aptiv (formerly Delphi) | Aptiv COV CONN PPL |
Produkt ist nicht verfügbar |
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| A8003SMHN1/9E34SMZ | NXP Semiconductors | 935360783431 |
Produkt ist nicht verfügbar |
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FH8065301567414S R1XA | Intel |
CPU - Central Processing Units Atom E3815 Single CR 1.46GHz FCBGA1170 A A 607-65301567414SR3V1 |
Produkt ist nicht verfügbar |
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FH8065301567414S R1XA | Intel |
MPU Atom™ Processor E3815 RISC 64bit 22nm 1.46GHz 1170-Pin FCBGA |
Produkt ist nicht verfügbar |
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FS32K148UJT0VLQT | NXP Semiconductors |
MCU 32-bit ARM Cortex M4F RISC 2MB Flash 3.3V/5V Automotive 144-Pin LQFP Tray |
Produkt ist nicht verfügbar |
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FS32K148UJT0VLUT | NXP Semiconductors |
MCU 32-bit ARM Cortex M4F RISC 2MB Flash 3.3V/5V Automotive 176-Pin LQFP Tray |
Produkt ist nicht verfügbar |
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MC35FS4500CAE | NXP Semiconductors |
Power System Basis Chip Automotive 48-Pin HLQFP EP Tray |
Produkt ist nicht verfügbar |
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MC35FS4500CAER2 | NXP Semiconductors |
Power Management Specialised - PMIC System Basis chip, Linear 0.5A Vcore, CAN, LQFP48EP, Tray |
Produkt ist nicht verfügbar |
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MC35FS4500CAER2 | NXP USA Inc. |
Description: FS4500 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MC35FS4500NAE | NXP Semiconductors |
Power System Basis Chip Automotive 48-Pin HLQFP EP Tray |
Produkt ist nicht verfügbar |
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MC35FS4500NAE | NXP USA Inc. |
Description: FS4500 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MC35FS4500NAER2 | NXP Semiconductors |
Interface Automotive 48-Pin HLQFP EP T/R |
Produkt ist nicht verfügbar |
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MC35FS4500NAER2 | NXP USA Inc. |
Description: FS4500 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MC35FS4501CAE | NXP Semiconductors |
Power System Basis Chip Automotive 48-Pin HLQFP EP Tray |
Produkt ist nicht verfügbar |
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MC35FS4501CAER2 | NXP Semiconductors |
Power System Basis Chip Automotive 48-Pin HLQFP EP T/R |
Produkt ist nicht verfügbar |
| FS32K148UJT0VLQR |
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Hersteller: NXP Semiconductors
ARM Microcontrollers - MCU S32K148 Arm Cortex-M4F, 112 MHz, 2 Mb Flash, FlexIO, CSEc security, ethernet, LQFP144 - S32K MCUs for General-Purpose
ARM Microcontrollers - MCU S32K148 Arm Cortex-M4F, 112 MHz, 2 Mb Flash, FlexIO, CSEc security, ethernet, LQFP144 - S32K MCUs for General-Purpose
auf Bestellung 500 Stücke:
Lieferzeit 287-301 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 48.85 EUR |
| 10+ | 39.03 EUR |
| 100+ | 32.97 EUR |
| 250+ | 27.82 EUR |
| FS32K148UJT0VLQT |
|
Hersteller: NXP Semiconductors
ARM Microcontrollers - MCU S32K148 Arm Cortex-M4F, 112 MHz, 2 Mb Flash, FlexIO, CSEc security, ethernet, LQFP144 - S32K MCUs for General-Purpose
ARM Microcontrollers - MCU S32K148 Arm Cortex-M4F, 112 MHz, 2 Mb Flash, FlexIO, CSEc security, ethernet, LQFP144 - S32K MCUs for General-Purpose
auf Bestellung 951 Stücke:
Lieferzeit 14-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 55.09 EUR |
| 10+ | 44.2 EUR |
| 100+ | 37.75 EUR |
| 300+ | 36.01 EUR |
| 600+ | 34.74 EUR |
| FS32K148UJT0VLQT |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
DigiKey Programmable: Not Verified
auf Bestellung 583 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 54.76 EUR |
| 10+ | 43.92 EUR |
| 80+ | 37.51 EUR |
| FS32K148UJT0VLUT |
|
Hersteller: NXP Semiconductors
ARM Microcontrollers - MCU S32K148 Arm Cortex-M4F, 112 MHz, 2 Mb Flash, FlexIO, CSEc security, ethernet, LQFP176 - S32K MCUs for General-Purpose
ARM Microcontrollers - MCU S32K148 Arm Cortex-M4F, 112 MHz, 2 Mb Flash, FlexIO, CSEc security, ethernet, LQFP176 - S32K MCUs for General-Purpose
auf Bestellung 70 Stücke:
Lieferzeit 14-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 57.15 EUR |
| 10+ | 45.81 EUR |
| 100+ | 39.16 EUR |
| FS32K148UJT0VLUT |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 156
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 156
DigiKey Programmable: Not Verified
auf Bestellung 200 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 56.73 EUR |
| 10+ | 45.49 EUR |
| 200+ | 38.85 EUR |
| IMX-MIPI-HDMI |
|
Hersteller: NXP Semiconductors
Interface Development Tools MIPI to HDMI adaptor card (mini SAS)
Interface Development Tools MIPI to HDMI adaptor card (mini SAS)
auf Bestellung 38 Stücke:
Lieferzeit 14-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 519.27 EUR |
| IMX-MIPI-HDMI |
|
Hersteller: NXP Semiconductors
High Reliability Evaluation Kit
High Reliability Evaluation Kit
auf Bestellung 5 Stücke:
Lieferzeit 14-21 Tag (e)| IMX-MIPI-HDMI |
|
Hersteller: NXP USA Inc.
Description: IMX-MIPI-HDMI
Packaging: Bulk
For Use With/Related Products: i.MX 8
Accessory Type: Interface Board
Part Status: Active
Description: IMX-MIPI-HDMI
Packaging: Bulk
For Use With/Related Products: i.MX 8
Accessory Type: Interface Board
Part Status: Active
auf Bestellung 13 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 495.77 EUR |
| MC35FS4500NAE |
|
Hersteller: NXP Semiconductors
Power Management Specialised - PMIC System Basis chip, Linear 0.5A Vcore, LQFP48EP, Tray
Power Management Specialised - PMIC System Basis chip, Linear 0.5A Vcore, LQFP48EP, Tray
auf Bestellung 250 Stücke:
Lieferzeit 55-69 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 21.27 EUR |
| 10+ | 19.21 EUR |
| 25+ | 18.36 EUR |
| 100+ | 15.94 EUR |
| 250+ | 14.17 EUR |
| 500+ | 13.7 EUR |
| 1000+ | 13.44 EUR |
| MC35FS4503CAE |
|
Hersteller: NXP Semiconductors
Power Management Specialised - PMIC Grade 0 safety CAN Buck/boost DC-DC
Power Management Specialised - PMIC Grade 0 safety CAN Buck/boost DC-DC
auf Bestellung 573 Stücke:
Lieferzeit 14-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 27.98 EUR |
| 10+ | 25.74 EUR |
| 25+ | 24.67 EUR |
| 100+ | 21.74 EUR |
| 250+ | 20.67 EUR |
| 500+ | 19.32 EUR |
| 1000+ | 17.73 EUR |
| MC35FS6500NAE |
|
Hersteller: NXP Semiconductors
Power Management Specialised - PMIC System Basis Chip, DCDC 0.8A Vcore, LQFP48EP, Tray
Power Management Specialised - PMIC System Basis Chip, DCDC 0.8A Vcore, LQFP48EP, Tray
auf Bestellung 250 Stücke:
Lieferzeit 79-93 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 21.81 EUR |
| 10+ | 19.71 EUR |
| 25+ | 17.84 EUR |
| 250+ | 17.58 EUR |
| 500+ | 16.17 EUR |
| 1000+ | 15.7 EUR |
| 2500+ | 15.55 EUR |
| MC35FS6513CAE |
|
Hersteller: NXP Semiconductors
Power Management Specialised - PMIC Grade 0 safety CAN Buck/boost DC-DC
Power Management Specialised - PMIC Grade 0 safety CAN Buck/boost DC-DC
auf Bestellung 310 Stücke:
Lieferzeit 14-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 29.59 EUR |
| 10+ | 26.68 EUR |
| 25+ | 22.54 EUR |
| 250+ | 21.09 EUR |
| 500+ | 19.68 EUR |
| 1000+ | 18.28 EUR |
| 2500+ | 17.91 EUR |
| MC35FS6513CAE |
|
Hersteller: NXP USA Inc.
Description: SBC, DCDC 1.5A VCORE FS1B CAN,15
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SBC, DCDC 1.5A VCORE FS1B CAN,15
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 176 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 28.81 EUR |
| 10+ | 26.47 EUR |
| 25+ | 25.38 EUR |
| 80+ | 22.36 EUR |
| MCIMX6L3DVN10AC |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Bulk
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Bulk
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
auf Bestellung 12786 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 13+ | 59.06 EUR |
| MCIMX6S5DVM10AD |
|
Hersteller: NXP Semiconductors
Processors - Application Specialised i.MX 6S ROM Perf Enhan
Processors - Application Specialised i.MX 6S ROM Perf Enhan
auf Bestellung 300 Stücke:
Lieferzeit 14-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 103.66 EUR |
| 10+ | 83.15 EUR |
| 100+ | 70.98 EUR |
| 300+ | 67.73 EUR |
| 600+ | 67.7 EUR |
| MCIMX6S5DVM10ADR |
|
Hersteller: NXP Semiconductors
SOC i.MX 6Solo ARM Cortex A9 40nm 624-Pin LFBGA T/R
SOC i.MX 6Solo ARM Cortex A9 40nm 624-Pin LFBGA T/R
auf Bestellung 500 Stücke:
Lieferzeit 14-21 Tag (e)| MCIMX6S5EVM10AD |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
auf Bestellung 300 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 104.96 EUR |
| 10+ | 85.16 EUR |
| 120+ | 73.94 EUR |
| MCIMX6S5EVM10AD |
|
Hersteller: NXP Semiconductors
Processors - Application Specialised i.MX 6S ROM Perf Enhan
Processors - Application Specialised i.MX 6S ROM Perf Enhan
auf Bestellung 300 Stücke:
Lieferzeit 140-154 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 105.72 EUR |
| 10+ | 85.77 EUR |
| 100+ | 74.46 EUR |
| MCIMX6S5EVM10ADR |
|
Hersteller: NXP Semiconductors
Processors - Application Specialised i.MX 6S ROM Perf Enhan
Processors - Application Specialised i.MX 6S ROM Perf Enhan
auf Bestellung 500 Stücke:
Lieferzeit 14-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 105.72 EUR |
| 10+ | 85.77 EUR |
| 100+ | 74.46 EUR |
| 250+ | 73.97 EUR |
| MCIMX6S6AVM10AD |
|
Hersteller: NXP Semiconductors
Processors - Application Specialised i.MX 6 series 32-bit MPU, ARM Cortex-A9 core, 1GHz, MAPBGA 624
Processors - Application Specialised i.MX 6 series 32-bit MPU, ARM Cortex-A9 core, 1GHz, MAPBGA 624
auf Bestellung 300 Stücke:
Lieferzeit 140-154 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 132.6 EUR |
| 10+ | 107.61 EUR |
| 100+ | 93.44 EUR |
| 300+ | 90.19 EUR |
| MCIMX6U1AVM08AD |
|
Hersteller: NXP Semiconductors
Processors - Application Specialised i.MX6 DL ROM Perf Enhan
Processors - Application Specialised i.MX6 DL ROM Perf Enhan
auf Bestellung 300 Stücke:
Lieferzeit 140-154 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 132.13 EUR |
| 10+ | 107.22 EUR |
| 100+ | 93.11 EUR |
| MCIMX6U5DVM10AD |
|
Hersteller: NXP Semiconductors
Processors - Application Specialised i.MX 6DL ROM Perf Enhan
Processors - Application Specialised i.MX 6DL ROM Perf Enhan
auf Bestellung 49 Stücke:
Lieferzeit 14-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 120.09 EUR |
| 10+ | 97.47 EUR |
| 100+ | 84.63 EUR |
| 300+ | 84.19 EUR |
| 600+ | 83.77 EUR |
| 1200+ | 82.97 EUR |
| 2700+ | 82.73 EUR |
| MCIMX6U5EVM10AD |
|
Hersteller: NXP Semiconductors
Processors - Application Specialised i.MX 6DL ROM Perf Enhan
Processors - Application Specialised i.MX 6DL ROM Perf Enhan
auf Bestellung 300 Stücke:
Lieferzeit 140-154 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 121.76 EUR |
| 10+ | 101.4 EUR |
| 100+ | 94.04 EUR |
| 300+ | 92.53 EUR |
| 1200+ | 92.43 EUR |
| 2700+ | 92.2 EUR |
| 5100+ | 92.14 EUR |
| MCIMX6U6AVM08AD |
|
Hersteller: NXP Semiconductors
Processors - Application Specialised i.MX6 ROM Perf Enhan
Processors - Application Specialised i.MX6 ROM Perf Enhan
auf Bestellung 300 Stücke:
Lieferzeit 14-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 144.17 EUR |
| 10+ | 116.97 EUR |
| 100+ | 101.56 EUR |
| 300+ | 98.05 EUR |
| MCIMX6U6AVM10AD |
|
Hersteller: NXP Semiconductors
Processors - Application Specialised i.MX 6 series 32-bit MPU, Dual ARM Cortex-A9 core, 1 GHz, MAPBGA 624
Processors - Application Specialised i.MX 6 series 32-bit MPU, Dual ARM Cortex-A9 core, 1 GHz, MAPBGA 624
auf Bestellung 300 Stücke:
Lieferzeit 14-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 152.83 EUR |
| 10+ | 124.88 EUR |
| 100+ | 112.79 EUR |
| 300+ | 107.51 EUR |
| MCIMX6U6AVM10AD |
|
Hersteller: NXP Semiconductors
SOC i.MX 6DualLite ARM Cortex A9 40nm Automotive 624-Pin LFBGA Tray
SOC i.MX 6DualLite ARM Cortex A9 40nm Automotive 624-Pin LFBGA Tray
auf Bestellung 120 Stücke:
Lieferzeit 14-21 Tag (e)| MCIMX6U8DVM10AD |
|
Hersteller: NXP Semiconductors
Processors - Application Specialised i.MX 6DL ROM Perf Enhan
Processors - Application Specialised i.MX 6DL ROM Perf Enhan
auf Bestellung 270 Stücke:
Lieferzeit 14-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 111.59 EUR |
| 10+ | 94.51 EUR |
| 100+ | 88.84 EUR |
| 300+ | 88.66 EUR |
| 600+ | 88.43 EUR |
| 1200+ | 87.8 EUR |
| 2700+ | 87.62 EUR |
| MK27FN2M0AVMI15 |
|
Hersteller: NXP Semiconductors
ARM Microcontrollers - MCU 150MHz ARM Cortex 2.1
ARM Microcontrollers - MCU 150MHz ARM Cortex 2.1
auf Bestellung 350 Stücke:
Lieferzeit 126-140 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 68.87 EUR |
| 10+ | 55.28 EUR |
| 100+ | 49.06 EUR |
| 260+ | 47.97 EUR |
| MK28FN2M0AVMI15 |
|
Hersteller: NXP Semiconductors
ARM Microcontrollers - MCU 150MHz ARM Cortex 2.1
ARM Microcontrollers - MCU 150MHz ARM Cortex 2.1
auf Bestellung 50 Stücke:
Lieferzeit 14-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 88.74 EUR |
| 10+ | 71.16 EUR |
| 100+ | 60.79 EUR |
| 260+ | 57.98 EUR |
| 520+ | 55.98 EUR |
| MMRF5017HSR5 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET HEMT 50V NI400
Packaging: Bulk
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 30MHz ~ 2.2GHz
Power - Output: 125W
Gain: 18.4dB
Technology: HEMT
Supplier Device Package: NI-400S-2S
Voltage - Rated: 150 V
Voltage - Test: 50 V
Current - Test: 200 mA
Description: RF MOSFET HEMT 50V NI400
Packaging: Bulk
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 30MHz ~ 2.2GHz
Power - Output: 125W
Gain: 18.4dB
Technology: HEMT
Supplier Device Package: NI-400S-2S
Voltage - Rated: 150 V
Voltage - Test: 50 V
Current - Test: 200 mA
auf Bestellung 125 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 582.92 EUR |
| MMRF5017HSR5 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET HEMT 50V NI400
Packaging: Tray
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 30MHz ~ 2.2GHz
Power - Output: 125W
Gain: 18.4dB
Technology: HEMT
Supplier Device Package: NI-400S-2S
Part Status: Active
Voltage - Rated: 150 V
Voltage - Test: 50 V
Current - Test: 200 mA
Description: RF MOSFET HEMT 50V NI400
Packaging: Tray
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 30MHz ~ 2.2GHz
Power - Output: 125W
Gain: 18.4dB
Technology: HEMT
Supplier Device Package: NI-400S-2S
Part Status: Active
Voltage - Rated: 150 V
Voltage - Test: 50 V
Current - Test: 200 mA
auf Bestellung 1 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 526.16 EUR |
| MRF13750HR5 |
|
Hersteller: NXP Semiconductors
RF MOSFET Transistors RF Power LDMOS Transistor 750 W
RF MOSFET Transistors RF Power LDMOS Transistor 750 W
auf Bestellung 27 Stücke:
Lieferzeit 14-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 455.08 EUR |
| 10+ | 452.69 EUR |
| 25+ | 440.36 EUR |
| 50+ | 435.76 EUR |
| OM40000UL |
|
Hersteller: NXP Semiconductors
Development Boards & Kits - ARM LPC802 Dev Tool LPCXresso802
Development Boards & Kits - ARM LPC802 Dev Tool LPCXresso802
auf Bestellung 14 Stücke:
Lieferzeit 14-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 63.31 EUR |
| OM40000UL |
|
Hersteller: NXP USA Inc.
Description: LPCXPRESSO LPC802 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Board Type: Evaluation Platform
Utilized IC / Part: LPC802
Platform: LPCXpresso™
Part Status: Active
Description: LPCXPRESSO LPC802 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Board Type: Evaluation Platform
Utilized IC / Part: LPC802
Platform: LPCXpresso™
Part Status: Active
auf Bestellung 208 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 58.01 EUR |
| OM40001UL |
|
Hersteller: NXP Semiconductors
Development Boards & Kits - ARM LPC804 Dev Tool LPCXresso804
Development Boards & Kits - ARM LPC804 Dev Tool LPCXresso804
auf Bestellung 33 Stücke:
Lieferzeit 765-779 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 76.83 EUR |
| OM40002UL |
|
Hersteller: NXP Semiconductors
Development Boards & Kits - ARM LPC8N04 NFC Kit
Development Boards & Kits - ARM LPC8N04 NFC Kit
auf Bestellung 9 Stücke:
Lieferzeit 14-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 62.69 EUR |
| OM40002UL |
|
Hersteller: NXP USA Inc.
Description: LPC8N04 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Board Type: Evaluation Platform
Utilized IC / Part: LPC8N04
Part Status: Active
Description: LPC8N04 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Board Type: Evaluation Platform
Utilized IC / Part: LPC8N04
Part Status: Active
auf Bestellung 14 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 62.27 EUR |
| OM40004UL |
|
Hersteller: NXP USA Inc.
Description: LPC845 CAPACITIVE TOUCH DEV. KIT
Packaging: Bulk
Sensor Type: Touch, Capacitive
Utilized IC / Part: LPC845
Supplied Contents: Board(s)
Part Status: Active
Description: LPC845 CAPACITIVE TOUCH DEV. KIT
Packaging: Bulk
Sensor Type: Touch, Capacitive
Utilized IC / Part: LPC845
Supplied Contents: Board(s)
Part Status: Active
auf Bestellung 25 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 190.68 EUR |
| OM40005UL |
|
Hersteller: NXP Semiconductors
Development Boards & Kits - ARM OM40005
Development Boards & Kits - ARM OM40005
auf Bestellung 10 Stücke:
Lieferzeit 14-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 108.47 EUR |
| OM40005UL |
|
Hersteller: NXP USA Inc.
Description: LPCXPRESSO LPC51U68 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Board Type: Evaluation Platform
Utilized IC / Part: LPC51U68
Platform: LPCXpresso™
Part Status: Active
Description: LPCXPRESSO LPC51U68 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Board Type: Evaluation Platform
Utilized IC / Part: LPC51U68
Platform: LPCXpresso™
Part Status: Active
auf Bestellung 23 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 103.53 EUR |
| TFA9891UK/N1/S1Z |
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D MONO 3.6W 49WLCSP
Packaging: Bulk
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 49-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Max Output Power x Channels @ Load: 3.6W x 1 @ 8Ohm
Supplier Device Package: 49-WLCSP (3.43x2.98)
Part Status: Obsolete
Description: IC AMP CLASS D MONO 3.6W 49WLCSP
Packaging: Bulk
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 49-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Max Output Power x Channels @ Load: 3.6W x 1 @ 8Ohm
Supplier Device Package: 49-WLCSP (3.43x2.98)
Part Status: Obsolete
auf Bestellung 1970 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 365+ | 1.97 EUR |
| UPS1C332MHD1TN |
|
Hersteller: Nichicon
Description: CAP ALUM 3300UF 20% 16V RADIAL
Packaging: Tape & Box (TB)
Tolerance: ±20%
Package / Case: Radial, Can
Size / Dimension: 0.630" Dia (16.00mm)
Polarization: Polar
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 105°C
Applications: General Purpose
Lead Spacing: 0.295" (7.50mm)
Lifetime @ Temp.: 3000 Hrs @ 105°C
Height - Seated (Max): 1.063" (27.00mm)
Part Status: Not For New Designs
Capacitance: 3300 µF
Voltage - Rated: 16 V
Impedance: 38 mOhms
Ripple Current @ Low Frequency: 1.653 A @ 120 Hz
Ripple Current @ High Frequency: 1.9 A @ 100 kHz
Description: CAP ALUM 3300UF 20% 16V RADIAL
Packaging: Tape & Box (TB)
Tolerance: ±20%
Package / Case: Radial, Can
Size / Dimension: 0.630" Dia (16.00mm)
Polarization: Polar
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 105°C
Applications: General Purpose
Lead Spacing: 0.295" (7.50mm)
Lifetime @ Temp.: 3000 Hrs @ 105°C
Height - Seated (Max): 1.063" (27.00mm)
Part Status: Not For New Designs
Capacitance: 3300 µF
Voltage - Rated: 16 V
Impedance: 38 mOhms
Ripple Current @ Low Frequency: 1.653 A @ 120 Hz
Ripple Current @ High Frequency: 1.9 A @ 100 kHz
auf Bestellung 250 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 250+ | 1.68 EUR |
| UPS1C332MHD1TN |
|
Hersteller: Nichicon
Description: CAP ALUM 3300UF 20% 16V RADIAL
Tolerance: ±20%
Packaging: Cut Tape (CT)
Package / Case: Radial, Can
Size / Dimension: 0.630" Dia (16.00mm)
Polarization: Polar
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 105°C
Applications: General Purpose
Lead Spacing: 0.295" (7.50mm)
Lifetime @ Temp.: 3000 Hrs @ 105°C
Height - Seated (Max): 1.063" (27.00mm)
Part Status: Not For New Designs
Capacitance: 3300 µF
Voltage - Rated: 16 V
Impedance: 38 mOhms
Ripple Current @ Low Frequency: 1.653 A @ 120 Hz
Ripple Current @ High Frequency: 1.9 A @ 100 kHz
Description: CAP ALUM 3300UF 20% 16V RADIAL
Tolerance: ±20%
Packaging: Cut Tape (CT)
Package / Case: Radial, Can
Size / Dimension: 0.630" Dia (16.00mm)
Polarization: Polar
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 105°C
Applications: General Purpose
Lead Spacing: 0.295" (7.50mm)
Lifetime @ Temp.: 3000 Hrs @ 105°C
Height - Seated (Max): 1.063" (27.00mm)
Part Status: Not For New Designs
Capacitance: 3300 µF
Voltage - Rated: 16 V
Impedance: 38 mOhms
Ripple Current @ Low Frequency: 1.653 A @ 120 Hz
Ripple Current @ High Frequency: 1.9 A @ 100 kHz
auf Bestellung 238 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 9+ | 3.2 EUR |
| 11+ | 2.39 EUR |
| 50+ | 2.18 EUR |
| 100+ | 1.79 EUR |
| 2-1393536-0 |
Hersteller: TE Connectivity AMP Connectors
Description: CONN DIP HDR IDC 40POS PCB
Packaging: Bulk
Features: Feed Through, Strain Relief
Connector Type: Ribbon Cable, DIP Header
Contact Finish: Tin
Mounting Type: Through Hole, Press-Fit
Number of Positions: 40
Row Spacing: 0.100" (2.54mm)
Contact Finish Thickness: 196.9µin (5.00µm)
Cable Termination: IDC
Cable Pitch: 0.050" (1.27mm)
Board-Side Pitch: 0.100" (2.54mm)
Number of Rows: 2
Description: CONN DIP HDR IDC 40POS PCB
Packaging: Bulk
Features: Feed Through, Strain Relief
Connector Type: Ribbon Cable, DIP Header
Contact Finish: Tin
Mounting Type: Through Hole, Press-Fit
Number of Positions: 40
Row Spacing: 0.100" (2.54mm)
Contact Finish Thickness: 196.9µin (5.00µm)
Cable Termination: IDC
Cable Pitch: 0.050" (1.27mm)
Board-Side Pitch: 0.100" (2.54mm)
Number of Rows: 2
Produkt ist nicht verfügbar
| FH8065301567414S R1XA |
|
Hersteller: Intel
CPU - Central Processing Units Atom E3815 Single CR 1.46GHz FCBGA1170 A A 607-65301567414SR3V1
CPU - Central Processing Units Atom E3815 Single CR 1.46GHz FCBGA1170 A A 607-65301567414SR3V1
Produkt ist nicht verfügbar
| FH8065301567414S R1XA |
|
Hersteller: Intel
MPU Atom™ Processor E3815 RISC 64bit 22nm 1.46GHz 1170-Pin FCBGA
MPU Atom™ Processor E3815 RISC 64bit 22nm 1.46GHz 1170-Pin FCBGA
Produkt ist nicht verfügbar
| FS32K148UJT0VLQT |
|
Hersteller: NXP Semiconductors
MCU 32-bit ARM Cortex M4F RISC 2MB Flash 3.3V/5V Automotive 144-Pin LQFP Tray
MCU 32-bit ARM Cortex M4F RISC 2MB Flash 3.3V/5V Automotive 144-Pin LQFP Tray
Produkt ist nicht verfügbar
| FS32K148UJT0VLUT |
|
Hersteller: NXP Semiconductors
MCU 32-bit ARM Cortex M4F RISC 2MB Flash 3.3V/5V Automotive 176-Pin LQFP Tray
MCU 32-bit ARM Cortex M4F RISC 2MB Flash 3.3V/5V Automotive 176-Pin LQFP Tray
Produkt ist nicht verfügbar
| MC35FS4500CAE |
|
Hersteller: NXP Semiconductors
Power System Basis Chip Automotive 48-Pin HLQFP EP Tray
Power System Basis Chip Automotive 48-Pin HLQFP EP Tray
Produkt ist nicht verfügbar
| MC35FS4500CAER2 |
|
Hersteller: NXP Semiconductors
Power Management Specialised - PMIC System Basis chip, Linear 0.5A Vcore, CAN, LQFP48EP, Tray
Power Management Specialised - PMIC System Basis chip, Linear 0.5A Vcore, CAN, LQFP48EP, Tray
Produkt ist nicht verfügbar
| MC35FS4500CAER2 |
|
Hersteller: NXP USA Inc.
Description: FS4500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: FS4500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MC35FS4500NAE |
|
Hersteller: NXP Semiconductors
Power System Basis Chip Automotive 48-Pin HLQFP EP Tray
Power System Basis Chip Automotive 48-Pin HLQFP EP Tray
Produkt ist nicht verfügbar
| MC35FS4500NAE |
|
Hersteller: NXP USA Inc.
Description: FS4500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: FS4500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MC35FS4500NAER2 |
|
Hersteller: NXP Semiconductors
Interface Automotive 48-Pin HLQFP EP T/R
Interface Automotive 48-Pin HLQFP EP T/R
Produkt ist nicht verfügbar
| MC35FS4500NAER2 |
|
Hersteller: NXP USA Inc.
Description: FS4500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: FS4500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MC35FS4501CAE |
|
Hersteller: NXP Semiconductors
Power System Basis Chip Automotive 48-Pin HLQFP EP Tray
Power System Basis Chip Automotive 48-Pin HLQFP EP Tray
Produkt ist nicht verfügbar
| MC35FS4501CAER2 |
|
Hersteller: NXP Semiconductors
Power System Basis Chip Automotive 48-Pin HLQFP EP T/R
Power System Basis Chip Automotive 48-Pin HLQFP EP T/R
Produkt ist nicht verfügbar
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