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APTGF50X60T3G Microchip Technology

Hersteller: Microchip Technology
Trans IGBT Module N-CH 600V 65A 250mW 32-Pin Case SP-3

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Technische Details APTGF50X60T3G Microchip Technology

Description: IGBT MODULE 600V 65A 250W SP3, Packaging: Bulk, Package / Case: SP3, Mounting Type: Chassis Mount, Input: Standard, Configuration: Three Phase Inverter, Vce(on) (Max) @ Vge, Ic: 2.45V @ 15V, 50A, NTC Thermistor: Yes, Supplier Device Package: SP3, IGBT Type: NPT, Current - Collector (Ic) (Max): 65 A, Voltage - Collector Emitter Breakdown (Max): 600 V, Power - Max: 250 W, Current - Collector Cutoff (Max): 250 µA, Input Capacitance (Cies) @ Vce: 2.2 nF @ 25 V.

Weitere Produktangebote APTGF50X60T3G

Foto	Bezeichnung	Hersteller	Beschreibung	Verfügbarkeit	Preis ohne MwSt
	APTGF50X60T3G	Hersteller : MICROSEMI	SP3POWER MODULE - IGBT Anzahl je Verpackung: 1 Stücke	Produkt ist nicht verfügbar
	APTGF50X60T3G	Hersteller : Microsemi Corporation	Description: IGBT MODULE 600V 65A 250W SP3 Packaging: Bulk Package / Case: SP3 Mounting Type: Chassis Mount Input: Standard Configuration: Three Phase Inverter Vce(on) (Max) @ Vge, Ic: 2.45V @ 15V, 50A NTC Thermistor: Yes Supplier Device Package: SP3 IGBT Type: NPT Current - Collector (Ic) (Max): 65 A Voltage - Collector Emitter Breakdown (Max): 600 V Power - Max: 250 W Current - Collector Cutoff (Max): 250 µA Input Capacitance (Cies) @ Vce: 2.2 nF @ 25 V	Produkt ist nicht verfügbar