Technische Details EA-230-H245-T710 Boyd Corporation
Category: Heatsinks, Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 23mm; W: 23mm, Material: aluminium; plastic, Colour: black, Length: 23mm, Application: BGA; FPGA, Type of heatsink: extruded, Width: 23mm, Heatsink shape: grilled, Height: 24.5mm, Material finishing: anodized, Anzahl je Verpackung: 1 Stücke.
Weitere Produktangebote EA-230-H245-T710
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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| EA-230-H245-T710 | Hersteller : BOYD CORP |
Category: Heatsinks Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 23mm; W: 23mm Material: aluminium; plastic Colour: black Length: 23mm Application: BGA; FPGA Type of heatsink: extruded Width: 23mm Heatsink shape: grilled Height: 24.5mm Material finishing: anodized Anzahl je Verpackung: 1 Stücke |
Produkt ist nicht verfügbar |
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EA-230-H245-T710 | Hersteller : Aavid |
 Heat Sinks Clip Attach, 23x23mm BGA Size, 24.5mm Heat Sink Height, T710 TIM |
Produkt ist nicht verfügbar |
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| EA-230-H245-T710 | Hersteller : BOYD CORP |
Category: Heatsinks Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 23mm; W: 23mm Material: aluminium; plastic Colour: black Length: 23mm Application: BGA; FPGA Type of heatsink: extruded Width: 23mm Heatsink shape: grilled Height: 24.5mm Material finishing: anodized |
Produkt ist nicht verfügbar |