Technische Details EA-230-H245-T710 Boyd Corporation
Category: Heatsinks, Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 23mm; W: 23mm, Application: BGA; FPGA, Material finishing: anodized, Type of heatsink: extruded, Heatsink shape: grilled, Material: aluminium; plastic, Length: 23mm, Width: 23mm, Height: 24.5mm, Colour: black.
Weitere Produktangebote EA-230-H245-T710
| Foto | Bezeichnung | Hersteller | Beschreibung |
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EA-230-H245-T710 | Hersteller : Aavid |
 Heat Sinks Extruded Heat Sink, BGA Clip Attach, 23x23mm, 24.5mm Heat Sink Height, T710 TIM |
Produkt ist nicht verfügbar |
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| EA-230-H245-T710 | Hersteller : BOYD CORP |
Category: Heatsinks Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 23mm; W: 23mm Application: BGA; FPGA Material finishing: anodized Type of heatsink: extruded Heatsink shape: grilled Material: aluminium; plastic Length: 23mm Width: 23mm Height: 24.5mm Colour: black |
Produkt ist nicht verfügbar |