FI-XB30SSL-HF15

FI-XB30SSL-HF15

Hersteller:

FI-XB30SSL-HF15.pdf
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Technische Details FI-XB30SSL-HF15

Description: CONN RCPT 30POS 1.0MM R/A SMD, Color: Beige, Contact Finish Thickness: 3.94µin (0.10µm), Features: Solder Retention, Termination: Solder, Mounting Type: Board Edge, Cutout, Pitch: 0.039" (1.00mm), Number of Positions Loaded: All, Number of Positions: 30, Contact Type: Female Socket, Connector Type: Receptacle.

Preis FI-XB30SSL-HF15 ab 0 EUR bis 0 EUR

FI-XB30SSL-HF15
Hersteller: JAE Electronics
Description: CONN RCPT 30POS 1.0MM R/A SMD
Color: Beige
Contact Finish Thickness: 3.94µin (0.10µm)
Features: Solder Retention
Termination: Solder
Mounting Type: Board Edge, Cutout
Pitch: 0.039" (1.00mm)
Number of Positions Loaded: All
Number of Positions: 30
Contact Type: Female Socket
Connector Type: Receptacle
FI-XB30SSL-HF15.pdf
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