FI-XB30SSL-HF15
Technische Details FI-XB30SSL-HF15
Description: CONN RCPT 30POS 1.0MM R/A SMD, Color: Beige, Contact Finish Thickness: 3.94µin (0.10µm), Features: Solder Retention, Termination: Solder, Mounting Type: Board Edge, Cutout, Pitch: 0.039" (1.00mm), Number of Positions Loaded: All, Number of Positions: 30, Contact Type: Female Socket, Connector Type: Receptacle.
Preis FI-XB30SSL-HF15 ab 0 EUR bis 0 EUR
FI-XB30SSL-HF15 Hersteller: JAE Electronics Description: CONN RCPT 30POS 1.0MM R/A SMD Color: Beige Contact Finish Thickness: 3.94µin (0.10µm) Features: Solder Retention Termination: Solder Mounting Type: Board Edge, Cutout Pitch: 0.039" (1.00mm) Number of Positions Loaded: All Number of Positions: 30 Contact Type: Female Socket Connector Type: Receptacle ![]() |
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