MPC850DEVR50BU NXP USA Inc.
Hersteller: NXP USA Inc.Description: IC MPU MPC8XX 50MHZ 256BGA
Packaging: Bulk
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
auf Bestellung 50 Stücke:
Lieferzeit 21-28 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 6+ | 136.13 EUR |
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Technische Details MPC850DEVR50BU NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 256BGA, Packaging: Bulk, Package / Case: 256-BBGA, Mounting Type: Surface Mount, Speed: 50MHz, Operating Temperature: 0°C ~ 95°C (TA), Core Processor: MPC8xx, Voltage - I/O: 3.3V, Supplier Device Package: 256-PBGA (23x23), Ethernet: 10Mbps (1), USB: USB 1.x (1), Number of Cores/Bus Width: 1 Core, 32-Bit, Co-Processors/DSP: Communications; CPM, RAM Controllers: DRAM, Graphics Acceleration: No, Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART.
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MPC850DEVR50BU | Hersteller : NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10Mbps (1) USB: USB 1.x (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART |
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