Technische Details US1010 UNISEM
Description: REPCO AB MOVABLE CONTACT X-33553, Part Status: Active, Package Accepted: Non Specific, Proto Board Type: Through Hole to SIP, Board Thickness: 0.031" (0.79mm) 1/32", Number of Positions: 10, Material: FR4 Epoxy Glass, Size / Dimension: 0.500" L x 1.000" W (12.70mm x 25.40mm), Packaging: Bag.
Weitere Produktangebote US1010
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US-1010 | Hersteller : Capital Advanced Technologies |
 Description: REPCO AB MOVABLE CONTACT X-33553Part Status: Active Package Accepted: Non Specific Proto Board Type: Through Hole to SIP Board Thickness: 0.031" (0.79mm) 1/32" Number of Positions: 10 Material: FR4 Epoxy Glass Size / Dimension: 0.500" L x 1.000" W (12.70mm x 25.40mm) Packaging: Bag |
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