ACC-HS3-SET Enclustra FPGA Solutions
Hersteller: Enclustra FPGA Solutions
Description: ACC HEATSINK ME ACC-HS3
Packaging: Box
Length: 2.205" (56.00mm)
Shape: Rectangular
Width: 1.063" (27.00mm)
Attachment Method: Bolt On
Fin Height: 0.571" (14.50mm)
Description: ACC HEATSINK ME ACC-HS3
Packaging: Box
Length: 2.205" (56.00mm)
Shape: Rectangular
Width: 1.063" (27.00mm)
Attachment Method: Bolt On
Fin Height: 0.571" (14.50mm)
auf Bestellung 108 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 69.73 EUR |
| 10+ | 65.64 EUR |
| 25+ | 61.54 EUR |
| 50+ | 57.44 EUR |
| 100+ | 55.39 EUR |
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Technische Details ACC-HS3-SET Enclustra FPGA Solutions
Description: ACC HEATSINK ME ACC-HS3, Packaging: Box, Length: 2.205" (56.00mm), Shape: Rectangular, Width: 1.063" (27.00mm), Attachment Method: Bolt On, Fin Height: 0.571" (14.50mm).