ACC-HS3-SET Enclustra FPGA Solutions
Hersteller: Enclustra FPGA Solutions
Description: ACC HEATSINK ME ACC-HS3
Packaging: Box
Length: 2.205" (56.00mm)
Shape: Rectangular
Width: 1.063" (27.00mm)
Attachment Method: Bolt On
Fin Height: 0.571" (14.50mm)
Description: ACC HEATSINK ME ACC-HS3
Packaging: Box
Length: 2.205" (56.00mm)
Shape: Rectangular
Width: 1.063" (27.00mm)
Attachment Method: Bolt On
Fin Height: 0.571" (14.50mm)
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Technische Details ACC-HS3-SET Enclustra FPGA Solutions
Description: ACC HEATSINK ME ACC-HS3, Packaging: Box, Length: 2.205" (56.00mm), Shape: Rectangular, Width: 1.063" (27.00mm), Attachment Method: Bolt On, Fin Height: 0.571" (14.50mm).