AGFB019R24C3E3V Intel
Hersteller: Intel
Description: IC FPGA AGILEX-F 2340BGA
Packaging: Tray
Package / Case: 2340-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.9M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2340-BGA (45x42)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 2340BGA
Packaging: Tray
Package / Case: 2340-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.9M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2340-BGA (45x42)
Architecture: MPU, FPGA
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Technische Details AGFB019R24C3E3V Intel
Description: IC FPGA AGILEX-F 2340BGA, Packaging: Tray, Package / Case: 2340-BFBGA Exposed Pad, Speed: 1.4GHz, RAM Size: 256KB, Operating Temperature: 0°C ~ 100°C (TJ), Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point, Primary Attributes: FPGA - 1.9M Logic Elements, Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG, Peripherals: DMA, WDT, Supplier Device Package: 2340-BGA (45x42), Architecture: MPU, FPGA.