Technische Details AGIB027R29A1E2V Intel
Description: IC, Packaging: Tray, Package / Case: 2957-BFBGA Exposed Pad, Speed: 1.4GHz, RAM Size: 256KB, Operating Temperature: 0°C ~ 100°C (TJ), Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point, Primary Attributes: FPGA - 2.7M Logic Elements, Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG, Peripherals: DMA, WDT, Supplier Device Package: 2957-BGA (56x45), Architecture: MPU, FPGA.
Weitere Produktangebote AGIB027R29A1E2V
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| AGIB027R29A1E2V | Hersteller : Intel |
Description: IC Packaging: Tray Package / Case: 2957-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 2.7M Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2957-BGA (56x45) Architecture: MPU, FPGA |
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