AIMDQ75R008M1HXUMA1 Infineon Technologies

Description: AUTOMOTIVE_SICMOS, Packaging: Tape & Reel (TR), Package / Case: 22-PowerBSOP Module, Mounting Type: Surface Mount, Operating Temperature: -55°C ~ 175°C (TJ), Technology: SiCFET (Silicon Carbide), FET Type: N-Channel, Current - Continuous Drain (Id) @ 25°C: 173A (Tc), Rds On (Max) @ Id, Vgs: 10.6mOhm @ 90.3A, 18V, Power Dissipation (Max): 625W (Tc), Vgs(th) (Max) @ Id: 5.6V @ 32.4mA, Supplier Device Package: PG-HDSOP-22, Grade: Automotive, Drive Voltage (Max Rds On, Min Rds On): 15V, 20V, Vgs (Max): +23V, -5V, Drain to Source Voltage (Vdss): 750 V, Gate Charge (Qg) (Max) @ Vgs: 178 nC @ 18 V, Input Capacitance (Ciss) (Max) @ Vds: 6135 pF @ 500 V, Qualification: AEC-Q101.