APF19-19-06CB/A01 CTS Electronic Components
auf Bestellung 3386 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 9.77 EUR |
| 10+ | 8.84 EUR |
| 25+ | 8.11 EUR |
| 100+ | 7.80 EUR |
| 250+ | 7.41 EUR |
| 500+ | 7.08 EUR |
| 1000+ | 6.86 EUR |
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Technische Details APF19-19-06CB/A01 CTS Electronic Components
Description: HEATSINK FORGED W/ADHESIVE TAPE, Packaging: Box, Material: Aluminum, Length: 0.748" (19.00mm), Shape: Square, Fins, Type: Top Mount, Width: 0.748" (19.00mm), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Attachment Method: Thermal Tape, Adhesive (Included), Thermal Resistance @ Forced Air Flow: 7.10°C/W @ 200 LFM, Fin Height: 0.250" (6.35mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote APF19-19-06CB/A01 nach Preis ab 7.12 EUR bis 9.91 EUR
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APF19-19-06CB/A01 | Hersteller : CTS Thermal Management Products |
 Description: HEATSINK FORGED W/ADHESIVE TAPEPackaging: Box Material: Aluminum Length: 0.748" (19.00mm) Shape: Square, Fins Type: Top Mount Width: 0.748" (19.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Thermal Tape, Adhesive (Included) Thermal Resistance @ Forced Air Flow: 7.10°C/W @ 200 LFM Fin Height: 0.250" (6.35mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 2499 Stücke: Lieferzeit 10-14 Tag (e) |
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