APF19-19-06CB CTS Electronic Components
auf Bestellung 1859 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 8.64 EUR |
| 10+ | 8.41 EUR |
| 25+ | 8.20 EUR |
| 100+ | 7.27 EUR |
| 250+ | 6.83 EUR |
| 500+ | 6.58 EUR |
| 1000+ | 5.91 EUR |
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Technische Details APF19-19-06CB CTS Electronic Components
Description: HEATSINK LOW-PROFILE FORGED, Packaging: Box, Material: Aluminum, Length: 0.748" (19.00mm), Shape: Square, Fins, Type: Top Mount, Width: 0.748" (19.00mm), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Attachment Method: Thermal Tape, Adhesive (Not Included), Thermal Resistance @ Forced Air Flow: 7.10°C/W @ 200 LFM, Fin Height: 0.250" (6.35mm), Material Finish: Black Anodized.
Weitere Produktangebote APF19-19-06CB
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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APF19-19-06CB | Hersteller : CTS Thermal Management Products |
 Description: HEATSINK LOW-PROFILE FORGEDPackaging: Box Material: Aluminum Length: 0.748" (19.00mm) Shape: Square, Fins Type: Top Mount Width: 0.748" (19.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Thermal Tape, Adhesive (Not Included) Thermal Resistance @ Forced Air Flow: 7.10°C/W @ 200 LFM Fin Height: 0.250" (6.35mm) Material Finish: Black Anodized |
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