APF19-19-06CB CTS Electronic Components
| Anzahl | Preis |
|---|---|
| 1+ | 7.81 EUR |
| 10+ | 7.6 EUR |
| 25+ | 7.41 EUR |
| 100+ | 6.56 EUR |
| 250+ | 6.16 EUR |
| 500+ | 5.95 EUR |
| 1000+ | 5.35 EUR |
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Technische Details APF19-19-06CB CTS Electronic Components
Description: HEATSINK LOW-PROFILE FORGED, Material Finish: Black Anodized, Fin Height: 0.250" (6.35mm), Thermal Resistance @ Forced Air Flow: 7.10°C/W @ 200 LFM, Attachment Method: Thermal Tape, Adhesive (Not Included), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Width: 0.748" (19.00mm), Type: Top Mount, Shape: Square, Fins, Length: 0.748" (19.00mm), Material: Aluminum, Packaging: Box.
Weitere Produktangebote APF19-19-06CB
| Foto | Bezeichnung | Hersteller | Beschreibung |
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APF19-19-06CB | Hersteller : CTS Thermal Management Products |
 Description: HEATSINK LOW-PROFILE FORGEDMaterial Finish: Black Anodized Fin Height: 0.250" (6.35mm) Thermal Resistance @ Forced Air Flow: 7.10°C/W @ 200 LFM Attachment Method: Thermal Tape, Adhesive (Not Included) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 0.748" (19.00mm) Type: Top Mount Shape: Square, Fins Length: 0.748" (19.00mm) Material: Aluminum Packaging: Box |
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