APF19-19-10CB/A01 CTS Thermal Management Products
Hersteller: CTS Thermal Management Products
Description: HEATSINK FORGED W/ADHESIVE TAPE
Packaging: Box
Material: Aluminum
Length: 0.748" (19.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 0.748" (19.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 5.30°C/W @ 200 LFM
Fin Height: 0.370" (9.40mm)
Material Finish: Black Anodized
Description: HEATSINK FORGED W/ADHESIVE TAPE
Packaging: Box
Material: Aluminum
Length: 0.748" (19.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 0.748" (19.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 5.30°C/W @ 200 LFM
Fin Height: 0.370" (9.40mm)
Material Finish: Black Anodized
auf Bestellung 1475 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
2+ | 9.56 EUR |
10+ | 9.3 EUR |
25+ | 8.79 EUR |
50+ | 8.27 EUR |
100+ | 7.75 EUR |
250+ | 7.23 EUR |
500+ | 6.72 EUR |
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Technische Details APF19-19-10CB/A01 CTS Thermal Management Products
Description: HEATSINK FORGED W/ADHESIVE TAPE, Packaging: Box, Material: Aluminum, Length: 0.748" (19.00mm), Shape: Square, Fins, Type: Top Mount, Width: 0.748" (19.00mm), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Attachment Method: Thermal Tape, Adhesive (Included), Thermal Resistance @ Forced Air Flow: 5.30°C/W @ 200 LFM, Fin Height: 0.370" (9.40mm), Material Finish: Black Anodized.
Weitere Produktangebote APF19-19-10CB/A01 nach Preis ab 8.25 EUR bis 9.79 EUR
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt | ||||||||||
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APF19-19-10CB/A01 | Hersteller : CTS Electronic Components | Heat Sinks 19x19x10mm Heat Sink 0.13mm 4000V/mil |
auf Bestellung 3008 Stücke: Lieferzeit 10-14 Tag (e) |
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