APF19-19-10CB/A01 CTS Electronic Components
auf Bestellung 493 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 9.31 EUR |
| 10+ | 9.06 EUR |
| 25+ | 8.18 EUR |
| 100+ | 7.60 EUR |
| 250+ | 7.11 EUR |
| 500+ | 6.65 EUR |
| 1000+ | 6.53 EUR |
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Technische Details APF19-19-10CB/A01 CTS Electronic Components
Description: HEATSINK FORGED W/ADHESIVE TAPE, Packaging: Box, Material: Aluminum, Length: 0.748" (19.00mm), Shape: Square, Fins, Type: Top Mount, Width: 0.748" (19.00mm), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Attachment Method: Thermal Tape, Adhesive (Included), Thermal Resistance @ Forced Air Flow: 5.30°C/W @ 200 LFM, Fin Height: 0.370" (9.40mm), Material Finish: Black Anodized.
Weitere Produktangebote APF19-19-10CB/A01 nach Preis ab 7.06 EUR bis 9.80 EUR
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APF19-19-10CB/A01 | Hersteller : CTS Thermal Management Products |
 Description: HEATSINK FORGED W/ADHESIVE TAPEPackaging: Box Material: Aluminum Length: 0.748" (19.00mm) Shape: Square, Fins Type: Top Mount Width: 0.748" (19.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Thermal Tape, Adhesive (Included) Thermal Resistance @ Forced Air Flow: 5.30°C/W @ 200 LFM Fin Height: 0.370" (9.40mm) Material Finish: Black Anodized |
auf Bestellung 1689 Stücke: Lieferzeit 10-14 Tag (e) |
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